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1. (WO2007010879) LIGHT-EMITTING MODULE AND MOUNTING BOARD USED THEREFOR
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/010879 International Application No.: PCT/JP2006/314118
Publication Date: 25.01.2007 International Filing Date: 10.07.2006
IPC:
H01L 33/50 (2010.01) ,H01L 25/075 (2006.01) ,H01L 33/54 (2010.01) ,H01L 33/56 (2010.01) ,H01L 33/62 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
50
Wavelength conversion elements
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
075
the devices being of a type provided for in group H01L33/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
56
Materials, e.g. epoxy or silicone resin
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
62
Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
Applicants:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501, JP (AllExceptUS)
MORIKAWA, Makoto; null (UsOnly)
UEMOTO, Takaari; null (UsOnly)
NISHIMOTO, Keiji; null (UsOnly)
SHIDA, Satoshi; null (UsOnly)
UENO, Yasuharu; null (UsOnly)
NAITO, Hiroyuki; null (UsOnly)
Inventors:
MORIKAWA, Makoto; null
UEMOTO, Takaari; null
NISHIMOTO, Keiji; null
SHIDA, Satoshi; null
UENO, Yasuharu; null
NAITO, Hiroyuki; null
Agent:
IKEUCHI SATO & PARTNER PATENT ATTORNEYS; 26th Floor, OAP TOWER, 8-30, Tenmabashi 1-chome Kita-ku, Osaka-shi, Osaka 5306026, JP
Priority Data:
2005-20735215.07.2005JP
Title (EN) LIGHT-EMITTING MODULE AND MOUNTING BOARD USED THEREFOR
(FR) MODULE ELECTROLUMINESCENT ET CARTE DE MONTAGE UTILISEE A CET EFFET
Abstract:
(EN) A light-emitting module (2) includes a mounting board (1) with a conductor pattern and a plurality of light-emitting elements (15) mounted on the conductor pattern via wires (21). The extending direction of each of the wires (21) toward the conductor pattern is oriented irregularly when viewed perpendicularly to the mounting board (1). This can prevent the shadows of the wires (21) from overlapping, and thus can suppress the luminance nonuniformity.
(FR) L'invention concerne un module électroluminescent (2) qui comporte une carte de montage (1) munie d'une matrice conductrice surmontée de plusieurs éléments électroluminescents (15) par le biais de fils (21). La direction de prolongement de chaque fil (21) vers la matrice conductrice est orientée de manière irrégulière, vue perpendiculairement à la carte de montage (1). On peut empêcher ainsi les ombres des fils (21) de se chevaucher et, par conséquent, supprimer la non-uniformité de la luminance.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1908124JP2009501431US20100079997