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Machine translation
1. (WO2007010810) LASER PROCESSING APPARATUS AND METHOD FOR ADJUSTING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/010810    International Application No.:    PCT/JP2006/313939
Publication Date: 25.01.2007 International Filing Date: 13.07.2006
IPC:
B23K 26/073 (2006.01), B23K 26/06 (2006.01), B28D 5/00 (2006.01)
Applicants: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501 (JP) (For All Designated States Except US).
KARASAKI, Hidehiko; (For US Only).
SUGIYAMA, Tsutomu; (For US Only).
HONGU, Hitoshi; (For US Only)
Inventors: KARASAKI, Hidehiko; .
SUGIYAMA, Tsutomu; .
HONGU, Hitoshi;
Agent: IWAHASHI, Fumio; c/o Matsushita Electric Industrial Co., Ltd. 1006, Oaza Kadoma Kadoma-shi, Osaka 5718501 (JP)
Priority Data:
2005-206440 15.07.2005 JP
Title (EN) LASER PROCESSING APPARATUS AND METHOD FOR ADJUSTING SAME
(FR) DISPOSITIF DE TRAITEMENT LASER ET SON PROCÉDÉ DE RÉGLAGE
(JA) レーザ加工装置およびその調整方法
Abstract: front page image
(EN)A laser processing apparatus (1001) is provided with a laser generating section (101) for generating a laser beam (301), and a driving section (105) for relatively shifting the laser beam (301) to a subject (106) to be processed and irradiating the subject (106) with the laser beam (301). The laser beam (301) is provided with a plurality of laser pulses having spots having a longitudinal direction. The driving section (105) relatively shifts the laser beam (301) to a subject (206) to be processed in a longitudinal direction so that laser pulses overlap each other. The laser processing apparatus (1001) can process the subject to be processed with high productivity and high quality.
(FR)La présente invention concerne un dispositif de traitement laser (1001) comportant une section génératrice de laser (101) générant un faisceau laser (301), et une section de commande (105) pour orienter le faisceau laser (301) de façon réactive vers un sujet (106) à traiter et irradier le sujet (106) avec le faisceau laser (301). Le faisceau laser (301) comporte une pluralité d'impulsions laser comportant des points présentant une direction longitudinale. La section de commande (105) oriente relativement le faisceau laser (301) vers un sujet (206) à traiter dans une direction longitudinale de sorte que les impulsions laser se superposent. Le dispositif de traitement laser (1001) peut traiter le sujet à traiter avec une forte productivité et une qualité élevée.
(JA)not available
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)