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1. (WO2007010783) HYBRID LASER PROCESSING DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/010783 International Application No.: PCT/JP2006/313750
Publication Date: 25.01.2007 International Filing Date: 11.07.2006
IPC:
B23K 26/08 (2006.01) ,B23K 26/06 (2006.01) ,B23P 17/00 (2006.01) ,B26F 3/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
08
Devices involving relative movement between laser beam and workpiece
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
P
OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
17
Metal-working operations, not covered by a single other subclass or another group in this subclass
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
F
PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
3
Severing by means other than cutting; Apparatus therefor
Applicants:
澁谷工業株式会社 SHIBUYA KOGYO CO., LTD. [JP/JP]; 〒9208681 石川県金沢市大豆田本町甲58番地 Ishikawa Koh, 58-banchi, Mameda-Honmachi, Kanazawa-shi Ishikawa 9208681, JP (AllExceptUS)
小関 良治 KOSEKI, Ryoji [JP/JP]; JP (UsOnly)
佐々木 基 SASAKI, Motoi [JP/JP]; JP (UsOnly)
河原 吉博 KAWAHARA, Yoshihiro [JP/JP]; JP (UsOnly)
Inventors:
小関 良治 KOSEKI, Ryoji; JP
佐々木 基 SASAKI, Motoi; JP
河原 吉博 KAWAHARA, Yoshihiro; JP
Agent:
神崎 真一郎 KANZAKI, Shin'ichiro; 〒1040031 東京都中央区京橋一丁目5番5号 京橋共同ビル7F Tokyo 7F Kyobashi Kyodo-Bldg. 5-5, Kyobashi 1-chome Chuo-ku, Tokyo 104-0031, JP
Priority Data:
2005-21081621.07.2005JP
Title (EN) HYBRID LASER PROCESSING DEVICE
(FR) DISPOSITIF DE TRAITEMENT LASER HYBRIDE
(JA) ハイブリッドレーザ加工装置
Abstract:
(EN) Laser light L emitted from a laser oscillator (4) is guided by an optical fiber (12), constituting a light guide means (7), up to a processing head (6) having a channel (25) through which high pressure liquid is supplied by a high pressure pump (5). The high pressure liquid is ejected as a liquid column W from an ejection hole (24) of an ejection nozzle (23) provided at the lower end of the processing head (6). The optical fiber is exposed to the interior of the liquid channel and the forward end of a fiber core (12a) of the optical fiber is projected from a fiber clad (12b) and located in the proximity of the ejection hole. Laser light emitted from the fiber core is reflected at a first inclined surface (24a) of the ejection hole and guided to the liquid column, and then a workpiece (2) is processed. The laser light can be easily guided to the liquid column.
(FR) La présente invention concerne une lumière laser L émise à partir d'un oscillateur laser (4) qui est guidée par une fibre optique (12), constituant un moyen servant de guide lumineux (7), jusqu'à une tête de traitement (6) ayant un canal (25) à travers lequel un liquide à haute pression est fourni par une pompe à haute pression (5). Le liquide à haute pression est expulsé comme une colonne liquide W à partir d'un orifice d'expulsion (24) d'une buse d'expulsion (23) prévue à l'extrémité inférieure de la tête de traitement (6). La fibre optique est exposée à l'intérieur du canal de liquide et l'extrémité avant d'une âme de fibre (12a) de la fibre optique s'avance en saillie à partir d'une gaine de fibre (12b) et est située à proximité de l'orifice d'expulsion. Une lumière laser émise à partir de l'âme de fibre est réfléchie sur une première surface inclinée (24a) de l'orifice d'expulsion et guidée vers la colonne liquide, puis une pièce à travailler (2) est traitée. La lumière laser peut être facilement guidée vers la colonne liquide.
(JA)  レーザ発振器4から発振されたレーザ光Lは、導光手段7を構成する光ファイバ12によって加工ヘッド6まで導光され、加工ヘッドには高圧ポンプ5よって高圧の液体が供給される液体通路25が形成され、この高圧の液体は加工ヘッド6の下端に設けられた噴射ノズル23の噴射孔24から液柱Wとなって噴射される。  上記光ファイバは上記液体通路の内部に露出しており、さらに光ファイバのファイバコア12aの先端は、ファイバクラッド12bよりも突出して上記噴射孔近傍に接近している。  そしてファイバコアから照射されたレーザ光は、噴射孔に形成された第1傾斜面24aに反射した後上記液柱に導光され、被加工物2の加工が行われる。  容易に液柱にレーザ光を導光することができる。
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020080028434EP1905529US20090045177CN101227998