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Machine translation
1. (WO2007010758) WIRING BOARD, WIRING MATERIAL, COPPER-CLAD LAMINATE, AND WIRING BOARD FABRICATION METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/010758    International Application No.:    PCT/JP2006/313559
Publication Date: 25.01.2007 International Filing Date: 07.07.2006
IPC:
H05K 1/11 (2006.01), H05K 3/38 (2006.01), H05K 3/40 (2006.01), H05K 3/46 (2006.01)
Applicants: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501 (JP) (For All Designated States Except US).
HIGASHITANI, Hideki; (For US Only)
Inventors: HIGASHITANI, Hideki;
Agent: IWAHASHI, Fumio; c/o Matsushita Electric Industrial Co., Ltd. 1006, Oaza Kadoma Kadoma-shi, Osaka 571-8501 (JP)
Priority Data:
2005-206426 15.07.2005 JP
2005-206427 15.07.2005 JP
2005-206428 15.07.2005 JP
Title (EN) WIRING BOARD, WIRING MATERIAL, COPPER-CLAD LAMINATE, AND WIRING BOARD FABRICATION METHOD
(FR) TABLEAU DE CONNEXIONS, MATÉRIEL DE CÂBLAGE, LAMINÉ PLAQUÉ CUIVRE ET PROCÉDÉ DE FABRICATION DE TABLEAU DE CONNEXIONS
(JA) 配線基板、配線材料、及び銅張積層板、及び配線基板の製造方法
Abstract: front page image
(EN)A wiring board includes an electrically insulating substrate (1), a through hole (3) formed in the electrically insulating substrate, conductive paste (4) filled in the through hole, and wiring (11) arranged on one side or both sides of the electrically insulating substrate and electrically connected to the conductive paste. The boundary in contact with the conductive paste in this wiring has a convex/concave surface or a flat surface. Furthermore, a plurality of particulate convex portions (14) are formed on the boundary.
(FR)La présente invention concerne un tableau de connexions comprenant un substrat isolant (1), un trou traversant (3) formé dans le substrat isolant, une pâte conductrice (4) remplissant le trou traversant et un câblage (11) disposé sur un côté ou sur les deux côtés du substrat isolant et en connexion électrique avec la pâte conductrice. Dans ce câblage, la ligne de séparation en contact avec la pâte conductrice possède une surface convexe/concave ou une surface plane. En outre, une pluralité de zones convexes particulaires (14) sont formées sur la ligne de séparation.
(JA) 本発明の配線基板は、電気絶縁性基材(1)と、この電気絶縁性基材に形成された貫通孔(3)と、この貫通孔に充填された導電性ペースト(4)と、電気絶縁性基材の片面または両面に配置され導電性ペーストと電気的に接続される配線(11)とを備え、この配線における導電性ペーストと接する界面は、凹凸表面と平坦表面の少なくともいずれか一方を有し、更に複数の粒状凸部(14)が形成される。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)