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1. (WO2007010725) WAFER POSITION TEACHING METHOD AND TEACHING TOOL
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/010725 International Application No.: PCT/JP2006/313027
Publication Date: 25.01.2007 International Filing Date: 29.06.2006
IPC:
B25J 9/22 (2006.01) ,B25J 19/06 (2006.01) ,B65G 49/07 (2006.01) ,H01L 21/677 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
25
HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
J
MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
9
Programme-controlled manipulators
16
Programme controls
22
Recording or playback systems
B PERFORMING OPERATIONS; TRANSPORTING
25
HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; HANDLES FOR HAND IMPLEMENTS; WORKSHOP EQUIPMENT; MANIPULATORS
J
MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
19
Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
06
Safety devices
B PERFORMING OPERATIONS; TRANSPORTING
65
CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
G
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
49
Conveying systems characterised by their application for specified purposes not otherwise provided for
05
for fragile or damageable materials or articles
07
for semiconductor wafers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677
for conveying, e.g. between different work stations
Applicants:
株式会社安川電機 KABUSHIKI KAISHA YASKAWA DENKI [JP/JP]; 〒8060004 福岡県北九州市八幡西区黒崎城石2番1号 Fukuoka 2-1, Kurosaki-shiroishi, Yahatanishi-ku, Kitakyushu-shi Fukuoka 8060004, JP (AllExceptUS)
足立 勝 ADACHI, Masaru [JP/JP]; JP (UsOnly)
川辺 満徳 KAWABE, Mitsunori [JP/JP]; JP (UsOnly)
Inventors:
足立 勝 ADACHI, Masaru; JP
川辺 満徳 KAWABE, Mitsunori; JP
Priority Data:
2005-20630415.07.2005JP
Title (EN) WAFER POSITION TEACHING METHOD AND TEACHING TOOL
(FR) PROCÉDÉ D’ENSEIGNEMENT DE POSITION DE GALETTE ET OUTIL D’ENSEIGNEMENT
(JA) ウェハ位置教示方法および教示治具装置
Abstract:
(EN) A method for teaching the wafer position precisely and automatically without causing interference even when the frontage of processing equipment is narrow, and an external teaching tool therefor. In the method for teaching a wafer position in a wafer carrying system, a robot for carrying a semiconductor wafer between a container and the processing equipment or between two units of the processing equipment is installed with a teaching tool (16) at the position of the container or the processing equipment where a semiconductor wafer is to be set, and the position of a semiconductor wafer is taught to the robot by detecting the teaching tool by a sensor provided at the wafer gripping portion of the robot. Prior to sensing the teaching tool (16) by means of a sensor, an external teaching tool (17) installed on the front outer wall of the processing equipment is sensed by means of a sensor and the position of the teaching tool is estimated roughly. Based on the estimated position, the teaching tool is approached and sensed thus determining the position of the semiconductor wafer.
(FR) L’invention concerne un procédé d’apprentissage de position de galette à la fois précis et automatique et ne provoquant d’interférence même lorsque la face frontale de l’équipement de traitement est étroite, et un outil d’apprentissage externe idoine. Selon le procédé d’apprentissage de position d’une galette dans un système de transport de galettes, un robot de transport de galettes semi-conductrices entre un conteneur et l’équipement de traitement ou bien entre deux unités de l’équipement de traitement est pourvu d’un outil d’apprentissage (16) au niveau du conteneur ou bien de l’équipement de traitement à l’endroit auquel disposer une galette semi-conductrice, et la position d’une galette semi-conductrice est enseignée au robot grâce à la détection de l’outil d’apprentissage à l’aide d’un capteur disposé au niveau de la portion de préhension de galette du robot. Avant de détecter l’outil d’apprentissage (16) au moyen d’un capteur, un outil d’apprentissage externe (17) installé sur la paroi externe avant de l’équipement de traitement est détecté par un capteur et la position de l’outil d’apprentissage est estimée de façon grossière. Sur la base de la position estimée, l’outil d’apprentissage est approché et détecté, pour ainsi déterminer la position de la galette semi-conductrice.
(JA)  処理装置の間口の狭い場合でも、干渉させることなくウェハ位置を精度良く自動的に教示する方法およびその外部教示治具を提供する。  本発明のウェハ搬送装置のウェハ位置教示方法は、収納容器と処理装置の間あるいは処理装置相互の間で半導体ウェハの搬送を行なうロボットに、収納容器あるいは処理装置の半導体ウェハを設置する位置に教示治具(16)を設置し、ロボットのウェハ把持部に設けたセンサで教示治具を検出することにより、ロボットに半導体ウェハの位置を教示するもので、教示治具(16)をセンサでセンシングする前に、処理装置の前面外壁に設置した外部教示治具(17)をセンサでセンシングにてセンシングを行い教示治具の位置をラフに推定し、その推定位置に基づいてセンサで教示治具にアプローチし、センシングして半導体ウェハの位置を求めるものである。
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020080009745EP1911552JPWO2007010725US20090198377CN101223010JP4930853