Processing

Please wait...

Settings

Settings

1. WO2007010717 - DOUBLE SIDE POLISHING METHOD FOR WAFER

Available information on National Phase entries(more information)
OfficeEntry DateNational NumberNational Status
China 28.06.2006200680026129.3
United States of America 15.01.200811988830Published: 14.05.2009
Granted: 01.06.2010
Republic of Korea 16.01.20081020087001296Refused: 27.05.2013
European Patent Office 17.01.20082006767473Published: 07.05.2008
Granted: 29.12.2010
GermanyWithdrawn: 22.01.2008