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1. (WO2007010315) LEADFRAME STRIP AND MOLD APPARATUS FOR AN ELECTRONIC COMPONENT AND METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/010315 International Application No.: PCT/IB2005/002084
Publication Date: 25.01.2007 International Filing Date: 20.07.2005
IPC:
H01L 21/56 (2006.01) ,H01L 23/495 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
495
Lead-frames
Applicants:
INFINEON TECHNOLOGIES AG [DE/DE]; St.-Martin-Str. 53 81669 München, DE (AllExceptUS)
LOW, Jeffrey Khai Huat [MY/MY]; MY (UsOnly)
LEE, Kean Cheong [MY/MY]; MY (UsOnly)
Inventors:
LOW, Jeffrey Khai Huat; MY
LEE, Kean Cheong; MY
Agent:
SCHÄFER, Horst; c/o Kanzlei Schweiger & Partner Karl-Theodor-Str. 69 80803 München, DE
Priority Data:
Title (EN) LEADFRAME STRIP AND MOLD APPARATUS FOR AN ELECTRONIC COMPONENT AND METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT
(FR) PLAQUETTE DE GRILLE DE CONNEXIONS ET APPAREIL DE MOULAGE POUR UN COMPOSANT ELECTRONIQUE ET PROCEDE D'ENCAPSULATION D'UN COMPOSANT ELECTRONIQUE
Abstract:
(EN) A leadframe strip (1) comprises a plurality of units (2) arranged in a line. Each unit (2) provides two component positions (3), each having a chip support substrate (6). The chip support substrates (6) of the two component positions (3) are mechanically linked by at least one support bar (18). The two component positions (3) of a unit (2) are molded at essentially the same time to produce a plastic housing (25) for a package (24) in each component position (3). The central portion of the first support bars (18) remains outside of the plastic housing (25) of the two packages (24).
(FR) La présente invention a trait à une plaquette de grille de connexions (1) comportant une pluralité d'unités (2) disposées dans une ligne. Chaque unité (2) fournit deux positions de composants (3), chacune comprenant un substrat de support de puces (6). Les substrats de supports de puces (6) des deux positions de composants (3) sont en liaison mécanique par au moins une barre de support (18). Les deux positions de composants (3) d'une unité (2) sont moulées sensiblement en même temps pour produire un boîtier en matière plastique (25) pour un boîtier (24) dans chaque position de composants (3). La portion centrale des premières barres de support (18) est maintenue à l'extérieur du boîtier en matière plastique (25) des deux boîtiers (24).
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20080290484