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1. (WO2007009510) METHOD FOR APPLYING ELECTRICAL CONDUCTOR PATTERNS TO A TARGET COMPONENT OF PLASTIC
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/009510 International Application No.: PCT/EP2006/003241
Publication Date: 25.01.2007 International Filing Date: 10.04.2006
Chapter 2 Demand Filed: 15.05.2007
IPC:
H05K 3/20 (2006.01) ,H05K 1/00 (2006.01) ,H05K 3/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
10
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
20
by affixing prefabricated conductor pattern
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants:
HIRSCHMANN CAR COMMUNICATION GMBH [DE/DE]; Stuttgarter Strasse 45-51 72654 Neckartenzlingen, DE (AllExceptUS)
PETERSEN, Ingmar [DE/DE]; DE (UsOnly)
PFLETSCHINGER, Markus [DE/DE]; DE (UsOnly)
SCHWARZ, Bernd [DE/DE]; DE (UsOnly)
FLUES, Martin [DE/DE]; DE (UsOnly)
KRÜGER, Jan [DE/DE]; DE (UsOnly)
Inventors:
PETERSEN, Ingmar; DE
PFLETSCHINGER, Markus; DE
SCHWARZ, Bernd; DE
FLUES, Martin; DE
KRÜGER, Jan; DE
Agent:
THUL, Hermann; Thul Patentanwaltsgesellschaft mbH Rheinmetall Allee 1 40476 Düsseldorf, DE
Priority Data:
10 2005 034 083.021.07.2005DE
Title (DE) VERFAHREN ZUM AUFBRINGEN VON ELEKTRISCHEN LEITERSTRUKTUREN AUF EIN ZIELBAUTEIL AUS KUNSTSTOFF
(EN) METHOD FOR APPLYING ELECTRICAL CONDUCTOR PATTERNS TO A TARGET COMPONENT OF PLASTIC
(FR) PROCEDE POUR APPLIQUER DES STRUCTURES CONDUCTRICES ELECTRIQUES SUR UN COMPOSANT CIBLE EN MATIERE PLASTIQUE
Abstract:
(DE) Die Erfindung betrifft ein Verfahren zum Aufbringen von elektrischen Leiterstrukturen (1) auf ein Zielbauteil (9) aus Kunststoff, wobei erfindungsgemäß vorgesehen ist, dass ein Transfermedium, auf dem die Leiterstrukturen (1) lösbar angeordnet sind, in ein Formteil (3, 8) eingelegt werden und das Formteil (3, 8) mit einer PUR- Schicht (5) aufgefüllt wird, wobei nach dem Aufschäumprozess das fertige Zielbauteil (9) dem Formteil (3, 8) entnommen wird.
(EN) The invention relates to a method for applying electrical conductor patterns (1) to a target component (9) of plastic, it being provided according to the invention that a transfer medium on which the conductor patterns (1) are detachably arranged is placed in a mould part (3, 8) and the mould part (3, 8) is filled with a PU layer (5), the finished target component (9) being removed from the mould part (3, 8) after the foaming process.
(FR) La présente invention concerne un procédé pour appliquer des structures conductrices électriques (1) sur un composant cible (9) en matière plastique. Selon cette invention, un milieu de transfert sur lequel les structures conductrices (1) sont placées de manière amovible est inséré dans une pièce moulée (3, 8) et la pièce moulée (3, 8) est remplie avec une couche de polyuréthane (5). Après le processus de moussage, le composant cible produit (9) est retiré de la pièce moulée (3, 8).
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)