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Machine translation
1. (WO2007009024) FOLDED FRAME CARRIER FOR MOSFET BGA
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/009024    International Application No.:    PCT/US2006/027167
Publication Date: 18.01.2007 International Filing Date: 12.07.2006
IPC:
H01L 21/50 (2006.01), H01L 21/48 (2006.01), H01L 21/44 (2006.01), H01L 23/495 (2006.01)
Applicants: FAIRCHILD SEMICONDUCTOR CORPORATION [US/US]; 82 RUNNING HILL ROAD, MS: 35-4e, South Portland, ME 04106 (US) (For All Designated States Except US).
MADRID, Ruben, P. [PH/PH]; (PH) (For US Only).
GESTOLE, Marvin [PH/PH]; (PH) (For US Only).
CRUZE, Erwin, Victor R. [PH/PH]; (PH) (For US Only).
MANATAD, Romel, N. [PH/PH]; (PH) (For US Only).
JAUD, Arniel [PH/PH]; (PH) (For US Only).
CALO, Paul, Armand [PH/PH]; (PH) (For US Only)
Inventors: MADRID, Ruben, P.; (PH).
GESTOLE, Marvin; (PH).
CRUZE, Erwin, Victor R.; (PH).
MANATAD, Romel, N.; (PH).
JAUD, Arniel; (PH).
CALO, Paul, Armand; (PH)
Agent: FITZGERALD, Thomas, R.; HISCOCK & BARCLAY, LLP, 2000 HSBC Plaza, Rochester, NY 14604-2404 (US)
Priority Data:
11/179,348 12.07.2005 US
Title (EN) FOLDED FRAME CARRIER FOR MOSFET BGA
(FR) SUPPORT DE CADRE REPLIE POUR GRILLE MATRICIELLE A BILLES (BGA) DE MOSFET
Abstract: front page image
(EN)A folded frame carrier has a die attach pad (DAP) (30) and one or more folded edges (32, 33, 34, 35). Each folded edge has one or more studs (36) and each stud has a trapezoidal tip. The folded frame carrier may be made of single gauge copper or copper alloy. Multiple folded frame carriers may be formed between opposite rails of a lead frame. The folded edges are cut with a relief groove. The tips are formed in edges of the DAP and then the tips are folded upright. The tips provide electrical connection to the terminal on the rear surface of a power semiconductor mounted on the DAP.
(FR)L'invention concerne un support de cadre replié comprenant une pastille de fixation de puce (DAP) (30) et un ou plusieurs bord(s) replié(s) (32, 33, 34, 35). Chaque bord replié comprend un ou plusieurs crampon(s) (36), chacun d'eux présentant une extrémité trapézoïdale. Le support de cadre replié est constitué de cuivre seul ou d'un alliage de cuivre. De multiples supports de cadre repliés peuvent être formés entre les rails opposés d'un cadre de montage. Les bords repliés sont coupés par une rainure en relief. Les pointes sont formées dans les bords de la DAP, puis repliées verticalement. Les pointes fournissent une connexion électrique avec le terminal sur la surface arrière d'un semi-conducteur de puissance monté sur la DAP.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)