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1. (WO2007008999) LOCALIZED SURFACE ANNEALING OF COMPONENTS FOR SUBSTRATE PROCESSING CHAMBERS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/008999 International Application No.: PCT/US2006/027078
Publication Date: 18.01.2007 International Filing Date: 12.07.2006
IPC:
C04B 41/00 (2006.01) ,H01L 21/00 (2006.01)
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
41
After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Applicants:
APPLIED MATERIALS, INC. [US/US]; P.O. Box 450A Santa Clara, CA 95052, US (AllExceptUS)
BHATNAGAR, Ashish [IN/US]; US (UsOnly)
MURUGESH, Laxman [US/US]; US (UsOnly)
GOPALAKRISHNAN, Padma [IN/US]; US (UsOnly)
Inventors:
BHATNAGAR, Ashish; US
MURUGESH, Laxman; US
GOPALAKRISHNAN, Padma; US
Agent:
JANAH, Ashok, K.; Janah & Associates, P.C. 640 Delancey Street, Suite 106 San Francisco, CA 94107, US
Priority Data:
11/181,04113.07.2005US
Title (EN) LOCALIZED SURFACE ANNEALING OF COMPONENTS FOR SUBSTRATE PROCESSING CHAMBERS
(FR) RECUIT SUPERFICIEL LOCALISE DE COMPOSANTS POUR CHAMBRES DE TRAITEMENT DE SUBSTRAT
Abstract:
(EN) A substrate processing chamber component has a structural body with localized surface regions having annealed microcracks. The annealed microcracks reduce crack propagation and increase fracture resistance. In one method of manufacture, the structural body of the component is formed by conventional means, and a laser beam is directed onto localized surface regions of the body for a sufficient time to anneal the surface microcracks.
(FR) Cette invention concerne un composant de chambre de traitement de substrat comprenant un corps structurel pourvu de zones superficielles localisées comportant des microfissures recuites. Les microfissures recuites réduisent la propagation des fissures et augmentent la résistance à la rupture. Dans un procédé de fabrication, le corps structurel du composant est formé au moyen de procédés conventionnels, et un faisceau laser est dirigé sur les zones superficielles localisées du corps pendant une durée suffisante pour que les microfissures superficielles soit recuites.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080033181EP1902003JP2009501452US20070014949CN101218191