Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2007008388) THERMAL MOUNTING PLATE FOR HEATED PRESSURE TRANSDUCER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/008388 International Application No.: PCT/US2006/024767
Publication Date: 18.01.2007 International Filing Date: 23.06.2006
IPC:
G01L 19/04 (2006.01) ,G01L 19/14 (2006.01)
G PHYSICS
01
MEASURING; TESTING
L
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19
Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
04
Means for compensating for effects of changes of temperature
G PHYSICS
01
MEASURING; TESTING
L
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19
Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14
Housings
Applicants:
MKS INSTRUMENTS, INC. [US/US]; 90 Industrial Way Wilmington, MA 01887, US (AllExceptUS)
MILLER, Craig, E. [US/US]; US (UsOnly)
POULIN, James, M. [US/US]; US (UsOnly)
Inventors:
MILLER, Craig, E.; US
POULIN, James, M.; US
Agent:
KUSMER, Toby, H. ; McDERMOTT WILL & EMERY LLP 28 State Street Boston, MA 02109, US
Priority Data:
11/180,37013.07.2005US
Title (EN) THERMAL MOUNTING PLATE FOR HEATED PRESSURE TRANSDUCER
(FR) PLAQUE DE SUPPORT THERMIQUE POUR TRANSDUCTEUR DE PRESSION CHAUFFÉ
Abstract:
(EN) A transducer assembly including a sensor housing, a heater shell located in the sensor housing, a heater operatively coupled to the heater shell, a sensor received in the heater shell, and an electronics assembly positioned within the sensor housing, outside of the heater shell, and adapted to receive signals from the sensor. The assembly also includes a mounting plate (400) positioned within the sensor housing, outside of the heater shell. The mounting plate (400) has arms (402) extending therefrom and at least one attachment point (404) where the electronics assembly is secured to the mounting plate (400) . The arms (402) are secured to the sensor housing, and the mounting plate (400) includes apertures (406) adjacent to the arms (402) for impeding thermal conduction between the arms (402) and the attachment point (404) .
(FR) La présente invention concerne un ensemble de transducteur comprenant un boîtier de capteur, une enveloppe chauffante située dans le boîtier de capteur, un dispositif de chauffage couplé de manière opérationnelle à l’enveloppe chauffante, un capteur placé dans l’enveloppe chauffante et un ensemble électronique placé dans le boîtier de capteur, à l’extérieur de l'enveloppe chauffante, et conçu pour recevoir des signaux provenant du capteur. L'ensemble comprend en outre une plaque de support (400) placée dans le boîtier de capteur, à l’extérieur de l’enveloppe chauffante. La plaque de support (400) comporte des bras (402) s'étendant à partir de celle-ci et au moins un point de fixation (404) au niveau duquel l’ensemble électronique est fixé à la plaque de support (400). Les bras (402) sont fixés au boîtier de capteur et la plaque de support (400) comporte des ouvertures (406) adjacentes aux bras (402) pour empêcher la conduction thermique entre les bras (402) et le point de fixation (404).
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080031669JP2009501338DE112006001662