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1. (WO2007008353) MONITORING SLOT FORMATION IN SUBSTRATES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/008353 International Application No.: PCT/US2006/024027
Publication Date: 18.01.2007 International Filing Date: 19.06.2006
IPC:
B41J 2/16 (2006.01) ,B23K 26/03 (2006.01) ,B23K 26/38 (2006.01) ,B23K 26/40 (2006.01) ,B23K 26/14 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
J
TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2
Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005
characterised by bringing liquid or particles selectively into contact with a printing material
01
Ink jet
135
Nozzles
16
Production of nozzles
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03
Observing the workpiece
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
40
taking account of the properties of the material involved
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
14
using a flow, e.g. a jet of gas, in conjunction with the laser beam
Applicants:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. [US/US]; Hewlett-Packard Company Intellectual Property Administration 20555 S.H. 249 Houston, Texas 77070, US (AllExceptUS)
GRAEME, Scott [IE/IE]; IE (UsOnly)
O'BRIEN, Seamus [IE/IE]; IE (UsOnly)
CAMPBELL-BROWN, Iain [IE/IE]; IE (UsOnly)
Inventors:
GRAEME, Scott; IE
O'BRIEN, Seamus; IE
CAMPBELL-BROWN, Iain; IE
Agent:
MCDANIEL, James R. ; Hewlett-Packard Company Intellectual Property Administration P.O. Box 272400 Mail Stop 35 Fort Collins, Colorado 80527-2400, US
Priority Data:
11/180,36913.07.2005US
Title (EN) MONITORING SLOT FORMATION IN SUBSTRATES
(FR) CONTROLE DE LA FORMATION DE FENTES DANS DES SUBSTRATS
Abstract:
(EN) A light beam (330) is used to cut a slot (140) in a first side of substrate (125). An optical sensor (370) monitors a surface (142) of a second side of the substrate (125) that is opposite the first side while cutting the slot (140). If the light beam (330) breaks through the surface (142) of the second side, the sensor (370) detects the light beam (330).
(FR) Selon l'invention, un faisceau lumineux (330) est utilisé pour pratiquer une fente (140) dans un premier côté d'un substrat (125). Un capteur optique (370) surveille une surface (142) d'un second côté du substrat (125) opposé au premier côté pendant la découpe de la fente (140). Si lors de la découpe le faisceau lumineux (330) traverse ladite surface (142) du second côté, le capteur (370) détecte le faisceau lumineux (330).
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1910084JP2009501087US20070013922US20070263231CN101223034