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1. (WO2007008342) THERMAL SOLUTION FOR PORTABLE ELECTRONIC DEVICES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/008342 International Application No.: PCT/US2006/023597
Publication Date: 18.01.2007 International Filing Date: 16.06.2006
IPC:
H05K 7/20 (2006.01) ,B32B 9/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
9
Layered products essentially comprising a particular substance not covered by groups B32B11/-B32B29/137
Applicants:
ADVANCED ENERGY TECHNOLOGY INC. [US/US]; 11709 Madison Avenue Lakewood, OH 44107, US (AllExceptUS)
SMALC, Martin, David [US/US]; US (UsOnly)
SHIVES, Gary, D. [US/US]; US (UsOnly)
REYNOLDS, Robert, Anderson, III [US/US]; US (UsOnly)
Inventors:
SMALC, Martin, David; US
SHIVES, Gary, D.; US
REYNOLDS, Robert, Anderson, III; US
Agent:
SHOUSE, Emily, A.; Waddey & Patterson Roundabout Plaza Suite 500 1600 Division Street Nashville, TN 37203, US
Priority Data:
11/176,59607.07.2005US
Title (EN) THERMAL SOLUTION FOR PORTABLE ELECTRONIC DEVICES
(FR) SOLUTION THERMIQUE DESTINEE A DES DISPOSITIFS ELECTRONIQUES PORTATIFS
Abstract:
(EN) A thermal solution (10) for a portable electronic device, which is positioned between a heat source (100) and another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the second component from the heat generated by the heat source.
(FR) L'invention concerne une solution thermique (10) destinée à un dispositif électronique portatif et positionnée entre une source de chaleur (100) et un autre composant du dispositif électronique, la solution thermique facilitant la dissipation thermique à partir de la source de chaleur tout en protégeant le second composant de la chaleur produite par la source thermique.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)