Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2007008311) APPARATUS AND METHOD FOR NON-CONTACT ASSESSMENT OF A CONSTITUENT IN SEMICONDUCTOR WORKPIECES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/008311 International Application No.: PCT/US2006/021580
Publication Date: 18.01.2007 International Filing Date: 01.06.2006
IPC:
G01B 11/06 (2006.01) ,G01N 21/00 (2006.01)
G PHYSICS
01
MEASURING; TESTING
B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
11
Measuring arrangements characterised by the use of optical means
02
for measuring length, width, or thickness
06
for measuring thickness
G PHYSICS
01
MEASURING; TESTING
N
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21
Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible, or ultra-violet light
Applicants:
NANOMETRICS INCORPORATED [US/US]; 1550 Buckeye Drive Milpitas, CA 95035, US (AllExceptUS)
BUCZKOWSKI, Andrzej [US/US]; US (UsOnly)
HUMMEL, Steve [US/US]; US (UsOnly)
Inventors:
BUCZKOWSKI, Andrzej; US
HUMMEL, Steve; US
Agent:
HALBERT, Michael, J. ; Silicon Valley Patent Group LLP 18805 Cox Avenue, Suite 220 Saratoga, CA 95070, US
Priority Data:
11/177,73508.07.2005US
Title (EN) APPARATUS AND METHOD FOR NON-CONTACT ASSESSMENT OF A CONSTITUENT IN SEMICONDUCTOR WORKPIECES
(FR) DISPOSITIF ET PROCEDE POUR L'EVALUATION SANS CONTACT DE COMPOSANT DE PIECE DE TRAVAIL EN SEMI-CONDUCTEUR
Abstract:
(EN) Methods and apparatus for assessing a constituent in a semiconductor workpiece are disclosed herein. Several embodiments of the invention are directed toward non-contact methods and systems for determining a dose and an implant energy of a dopant or other constituent implanted in a semiconductor workpiece. For example, one embodiment of a non-contact method for assessing a constituent in a semiconductor workpiece includes irradiating a portion of the semiconductor workpiece, measuring photoluminescence from the irradiated portion of the semiconductor workpiece, and determining a physical property of a doped structure in the semiconductor workpiece based on the measured photoluminescence.
(FR) Procédés et dispositifs pour l'évaluation de composant dans une pièce de travail en semi-conducteur. Sous plusieurs variantes, on décrit des procédés sans contact et des systèmes correspondants permettant de déterminer une dose et une énergie d'implantation de dopant ou d'autre composant implanté dans cette pièce. Selon une variante, par exemple, on décrit un procédé qui consiste à irradier une partie de la pièce, à mesurer la photoluminescence de cette partie et à déterminer une propriété physique de structure dopée dans la pièce sur la base de la mesure effectuée.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)