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1. (WO2007008310) ELECTRICAL CIRCUIT APPARATUS AND METHOD FOR ASSEMBLING SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/008310 International Application No.: PCT/US2006/021461
Publication Date: 18.01.2007 International Filing Date: 02.06.2006
IPC:
B23K 31/02 (2006.01) ,B23K 37/04 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
31
Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/-B23K28/193
02
relating to soldering or welding
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
37
Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the other main groups of this subclass
04
for holding or positioning work
Applicants:
MOTOROLA, INC. [US/US]; 1303 East Algonquin Road Schaumburg, Illinois 60196, US (AllExceptUS)
WALDVOGEL, John, M. [US/US]; US (UsOnly)
MILLER, Herman, J. [US/US]; US (UsOnly)
Inventors:
WALDVOGEL, John, M.; US
MILLER, Herman, J.; US
Agent:
DAVIS, Valerie, M. ; 1303 East Algonquin Road Schaumburg, Illinois 60196, US
Priority Data:
11/180,18813.07.2005US
Title (EN) ELECTRICAL CIRCUIT APPARATUS AND METHOD FOR ASSEMBLING SAME
(FR) DISPOSITIF DE CIRCUIT ÉLECTRIQUE ET SON PROCÉDÉ D’ASSEMBLAGE
Abstract:
(EN) An electrical circuit apparatus (300) that includes; a substrate (330) having a top side, a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture (322) wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
(FR) La présente invention concerne un dispositif de circuit électrique (300) comprenant un substrat (330) avec un côté supérieur, une couche de base (336), au moins une ouverture thermique (332) et au moins une ouverture de brasage (334), un puits de chaleur (310) et une couche adhésive (320) pour coupler mécaniquement le puits de chaleur à la couche de base du substrat, la couche adhésive présentant au moins une ouverture thermique (322), l'alignement de l'ouverture de brasage du substrat avec l'ouverture de la couche adhésive permettant un mouillage du métal d'apport de brasage dans une zone prédéterminée entre le puits de chaleur et la couche de base du substrat.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1907165