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1. (WO2007008169) ELECTRONIC DEVICE AND METHOD FOR ITS MANUFACTURE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/008169 International Application No.: PCT/SE2006/050253
Publication Date: 18.01.2007 International Filing Date: 10.07.2006
IPC:
H05K 3/46 (2006.01) ,B32B 15/00 (2006.01) ,H05K 7/20 (2006.01) ,H05K 1/03 (2006.01) ,H05K 3/02 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7
Constructional details common to different types of electric apparatus
20
Modifications to facilitate cooling, ventilating, or heating
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Applicants:
ALUWAVE AKTIEBOLAG [SE/SE]; Argongatan 28 S-431 53 Mölndal, SE (AllExceptUS)
MAGNUSSON, Hans [SE/SE]; SE (UsOnly)
Inventors:
MAGNUSSON, Hans; SE
Agent:
HYNELL PATENTTJÄNST AB; Patron Carls Väg 2 S-683 40 Hagfors/uddeholm, SE
Priority Data:
0501647-211.07.2005SE
Title (EN) ELECTRONIC DEVICE AND METHOD FOR ITS MANUFACTURE
(FR) DISPOSITIF ELECTRONIQUE ET PROCEDE DE FABRICATION DE CELUI-CI
Abstract:
(EN) An electronic device (1) is disclosed. It comprises a base (3), a part of a surface of which is covered with an insulating material (5), a Cr/Ni layer (7) on the insulating material (5), an intermediate metallic layer (9) on the Cr/Ni layer (7), a Cu layer (11) on the Ni layer (9), wherein the Cu layer (11) presents a thickness of at least 3 microns. Application of the electronic device (1) includes printed circuit boards, mechanical micro wave components, and a chassis. Also disclosed is a method for providing a metal layer on an electrically insulating material.
(FR) L'invention concerne un dispositif électronique (1). Ce dispositif comprend une base (3) dont une partie de la surface est recouverte d'une matière isolante (5), une couche Cr/Ni (7) sur la matière isolante (5), une couche métallique intermédiaire (9) sur la couche Cr/Ni (7), une couche Cu (11) sur la couche Ni (9), l'épaisseur de la couche Cu (11) étant d'au moins 3 microns. Ce dispositif électronique (1) s'utilise entre autres dans des cartes à circuit imprimé, des composants mécaniques hyperfréquence et un châssis. L'invention concerne aussi un procédé d'application d'une couche métallique sur une matière électriquement isolante.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)