Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2007008046) BONDING APPARATUS AND METHOD OF METAL PLATE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/008046 International Application No.: PCT/KR2006/002780
Publication Date: 18.01.2007 International Filing Date: 14.07.2006
IPC:
B23K 11/11 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
11
Resistance welding; Severing by resistance heating
10
Spot welding; Stitch welding
11
Spot welding
Applicants:
JIN, In Tai [KR/KR]; KR
Inventors:
JIN, In Tai; KR
Agent:
YOU ME PATENT AND LAW FIRM; Seolim Bldg., 649-10 Yoksam-dong, Kangnam-ku Seoul, 135-080, KR
Priority Data:
10-2005-006350314.07.2005KR
Title (EN) BONDING APPARATUS AND METHOD OF METAL PLATE
(FR) APPAREIL DE SCELLEMENT ET MÉTHODE DE PLAQUE MÉTALLIQUE
Abstract:
(EN) A bonding apparatus and method of metal plates simplifies a bonding process and improves bonding strength of metal plates. A bonding apparatus of metal plates may include an upper mold having a first guide pathway formed vertically inside thereof; a middle mold having a second guide pathway formed vertically inside thereof, the middle mold being disposed under the upper mold; a lower mold having a metal removing pathway formed vertically inside thereof, the lower mold being disposed under the middle mold; a heating unit for heating the metal plates and a metal tape; a punch for applying a bonding load to the metal plates; a clamping unit that applies a clamping load for clamping the metal plates to the upper mold; and a bonding unit that applies the bonding load to the punch for bonding the metal plates.
(FR) La présente invention concerne un appareil de scellement et une méthode de plaques métalliques qui simplifient un processus de scellement et améliorent la force de scellement de plaques métalliques. Un appareil de scellement de plaques métallique peut inclure un moule supérieur ayant un premier chemin guide formé verticalement en son sein ; un moule médian ayant un deuxième chemin guide formé verticalement en son sein, le moule médian étant disposé sous le moule supérieur ; un moule inférieur ayant un chemin d’évacuation de métal formé verticalement en son sein, le moule inférieur étant disposé sous le moule médian ; une unité de chauffage pour chauffer les plaques métalliques et la bande métallique ; un poinçon pour appliquer une charge de scellement aux plaques métalliques ; une unité de pince appliquant une charge de pincement pour pincer les plaques métalliques et le moule supérieur ; et une unité de scellement qui applique la charge de scellement au poinçon pour sceller les plaques métalliques.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
CZPV2008-54JP2009501086US20080197117CN101222997DE112006001867