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1. (WO2007007736) PROBE CARD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/007736 International Application No.: PCT/JP2006/313738
Publication Date: 18.01.2007 International Filing Date: 11.07.2006
IPC:
G01R 1/073 (2006.01) ,G01R 1/067 (2006.01) ,G01R 31/28 (2006.01) ,H01L 21/66 (2006.01)
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
073
Multiple probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28
Testing of electronic circuits, e.g. by signal tracer
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
Applicants:
東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 〒1078481 東京都港区赤坂五丁目3番6号 Tokyo 3-6, Akasaka 5-chome, Minato-ku, Tokyo 1078481, JP (AllExceptUS)
竹腰 清 TAKEKOSHI, Kiyoshi [JP/JP]; JP (UsOnly)
Inventors:
竹腰 清 TAKEKOSHI, Kiyoshi; JP
Agent:
金本 哲男 KANEMOTO, Tetsuo; 〒1620065 東京都新宿区住吉町1-12 新宿曙橋ビル はづき国際特許事務所 Tokyo Hazuki International Shinjuku Akebonobashi Building 1-12, Sumiyoshi-cho Shinjuku-ku, Tokyo 1620065, JP
Priority Data:
2005-20389213.07.2005JP
Title (EN) PROBE CARD
(FR) CARTE SONDE
(JA) プローブカード
Abstract:
(EN) On a probe card supporting plate having a same area as that of the conventional one, guide holes are formed with a narrower pitch compared with the conventional one, a degree of freedom in selecting an elastic member for urging the probe pin is improved, and inspection of highly integrated devices is accurately performed. The probe card is provided with a circuit board, and the supporting plate arranged below the circuit board for supporting the probe pin. The probe pin having an elastic section and a pin section is inserted into a guide hole formed on the supporting plate, and the leading edge of the pin section protrudes downward from the supporting plate. The guide hole has a square horizontal cross-section shape.
(FR) Selon l’invention, sur une plaque de support de carte sonde comportant une zone identique à celle d’une plaque classique, des orifices de guidage sont formés avec un pas plus étroit que celui de la plaque classique, le degré de liberté dans la sélection d’un élément élastique pour pousser la broche sonde est amélioré, et le contrôle de dispositifs hautement intégrés est réalisé avec précision. La carte sonde est dotée d’une carte de circuit imprimé, et la plaque de support est installée en dessous de la carte de circuit imprimé pour supporter la broche sonde. La broche sonde comportant une section élastique et une section de broche est insérée dans un orifice de guidage formé sur la plaque de support, et le bord d’attaque de la section de broche fait saillie vers le bas depuis la plaque de support. L’orifice de guidage a une forme de profil horizontale carrée.
(JA)  本発明は、プローブカードにおける同一面積の支持板において、従来よりも狭ピッチのガイド孔を形成し、プローブピンを付勢するための弾性部材の選択の自由度も高めて、高集積化デバイスの検査を精細に行うことを目的としている。本発明は、回路基板と、当該回路基板の下に配置されてプローブピンを支持する支持板とを有している。支持板に形成されたガイド孔内に、弾性部とピン部を有するプローブピンが挿入され、ピン部の先端は支持板の下方に突出している。ガイド孔は、その水平断面形状が四角形である。
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020080027389US20090144971