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Pub. No.:    WO/2007/007627    International Application No.:    PCT/JP2006/313466
Publication Date: 18.01.2007 International Filing Date: 06.07.2006
H05K 1/14 (2006.01)
Applicants: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501 (JP) (For All Designated States Except US).
MORI, Masato; (For US Only).
YAGI, Yoshihiko; (For US Only).
ONO, Masahiro; (For US Only).
TOMURA, Yoshihiro; (For US Only).
HIBINO, Kunio; (For US Only).
NAKAGIRI, Yasushi; (For US Only).
MIYASHITA, Akihiro; (For US Only).
SAKURAI, Kunio; (For US Only)
Inventors: MORI, Masato; .
YAGI, Yoshihiko; .
ONO, Masahiro; .
TOMURA, Yoshihiro; .
HIBINO, Kunio; .
NAKAGIRI, Yasushi; .
MIYASHITA, Akihiro; .
Agent: IWAHASHI, Fumio; c/o Matsushita Electric Industrial Co., Ltd., 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501 (JP)
Priority Data:
2005-201491 11.07.2005 JP
(JA) 基板接続部材および接続構造体
Abstract: front page image
(EN)A substrate connecting member, by which even when a circuit board is warped due to temperature change and shock weight when two circuit boards are connected, high reliability of a connecting section between the circuit board and the connecting member can be maintained. The substrate connecting member is provided with a frame body (2) composed of an insulating resin; a cut groove (4) arranged at least on an inner circumference plane or an outer circumference plane of frame side portions (2A, 2B, 2C, 2D) which constitute the frame body (2), in a direction orthogonally intersecting with the thickness direction of the frame side portions (2A, 2B, 2C, 2D), over the entire length of the frame side portions (2A, 2B, 2C, 2D); and a connecting conductor section (3) composed of connecting terminals (3A, 3B) arranged on an upper plane and a lower plane in the thickness direction of the frame side portions (2A, 2B, 2C, 2D), respectively, and a connecting conductor (3C) for connecting the connecting terminals (3A, 3B).
(FR)L’invention concerne un élément de connexion de substrat permettant, même en cas de gauchissement d’une plaquette de circuit du fait d’un changement de température et d'un poids d’impact lors de la connexion de deux plaquettes de circuit, de conserver une grande fiabilité d’une section de connexion entre la plaquette de circuit et l’élément de connexion. L’élément de connexion de substrat est muni d’un corps de châssis (2) composé d’une résine isolante ; d’une rainure découpée (4) disposée au moins sur un plan circonférentiel interne ou un plan circonférentiel externe de portions latérales de châssis (2A, 2B, 2C, 2D) qui constituent le corps de châssis (2), dans une direction coupant à angle droit le sens de l'épaisseur des portions latérales de châssis (2A, 2B, 2C, 2D), sur toute la longueur des portions latérales de châssis (2A, 2B, 2C, 2D) ; et d'une section de conducteur de connexion (3) composée de bornes de connexion (3A, 3B) disposées sur un plan supérieur et un plan inférieur dans le sens de l’épaisseur des portions latérales de châssis (2A, 2B, 2C, 2D), respectivement, et d'un conducteur de connexion (3C) permettant de connecter les bornes de connexion (3A, 3B).
(JA) 2枚の回路基板を接続した場合に、温度変動や衝撃加重により回路基板に反りが生じても、回路基板と接続部材との接続部の高信頼性を保持することが可能な基板接続部材を提供する。絶縁性樹脂からなる枠体(2)と、この枠体(2)を構成する枠辺部(2A、2B、2C、2D)の内周側面と外周側面の少なくとも一方に、上記枠辺部(2A、2B、2C、2D)の厚み方向と直交する方向で、かつ上記枠辺部(2A、2B、2C、2D)の全長にわたって設けた切込み溝(4)と、上記枠辺部(2A、2B、2C、2D)の厚み方向の上面および下面にそれぞれ設けた接続端子(3A、3B)と、これらの接続端子(3A、3B)同士を接続するための接続用導体(3C)とからなる接続導体部(3)とを有する構成からなる。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)