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1. (WO2007007623) ELECTRONIC COMPONENT MOUNTING APPARATUS, HEIGHT DETECTION METHOD FOR ELECTRONIC COMPONENT, AND OPTICAL-AXIS ADJUSTMENT METHOD FOR COMPONENT HEIGHT DETECTION UNIT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/007623 International Application No.: PCT/JP2006/313441
Publication Date: 18.01.2007 International Filing Date: 29.06.2006
IPC:
H05K 3/04 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
02
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
04
the conductive material being removed mechanically, e.g. by punching
Applicants:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP/JP]; 1006, Oaza Kadoma, Kadoma-shi, Osaka 5718501, JP (AllExceptUS)
HIYOSHI, Masanori; null (UsOnly)
SAHO, Hidehiro; null (UsOnly)
YAMASAKI, Noboru; null (UsOnly)
ENDO, Tadashi; null (UsOnly)
Inventors:
HIYOSHI, Masanori; null
SAHO, Hidehiro; null
YAMASAKI, Noboru; null
ENDO, Tadashi; null
Agent:
KAWAMIYA, Osamu ; AOYAMA & PARTNERS IMP Building 3-7, Shiromi 1-chome, Chuo-ku, Osaka-shi Osaka 5400001, JP
Priority Data:
2005-19987608.07.2005JP
2005-24564326.08.2005JP
2005-24897630.08.2005JP
Title (EN) ELECTRONIC COMPONENT MOUNTING APPARATUS, HEIGHT DETECTION METHOD FOR ELECTRONIC COMPONENT, AND OPTICAL-AXIS ADJUSTMENT METHOD FOR COMPONENT HEIGHT DETECTION UNIT
(FR) DISPOSITIF DE MONTAGE POUR COMPOSANT ELECTRONIQUE, TECHNIQUE DE DETECTION DE LA HAUTEUR POUR LE COMPOSANT ELECTRONIQUE ET REGLAGE DE L'AXE OPTIQUE POUR L'UNITE DE DETECTION DE LA HAUTEUR
Abstract:
(EN) An electronic component mounting apparatus includes a beam projector for projecting a laser beam, a beam receiver which is placed in opposition to the beam projector and which receives a laser beam projected from the beam projector, a light-reception-sensitivity setting unit for adjusting light-reception sensitivity of the beam receiver, a projection-side orifice provided in the beam projector to narrow a projection spot diameter of the laser beam, and a reception-side orifice provided in the beam receiver to narrow a light-reception spot diameter, where the light-reception sensitivity of the beam receiver is improved. As a result, an electronic component mounting apparatus capable of accurately detecting height size of small components by using a relatively inexpensive photoelectric sensor can be provided.
(FR) Dispositif de montage pour composants électroniques, comprenant un projecteur de faisceau laser, un récepteur de faisceau disposé en face du projecteur dont il reçoit le faisceau laser, une unité de réglage de sensibilité- réception de la lumière, un orifice de projection latéral pratiqué dans le projecteur de faisceau qui permet de réduire le diamètre du point de projection du faisceau laser, et un orifice de réception latéral pratiqué dans le récepteur de faisceau qui permet de réduire le diamètre du point de réception de la lumière, avec pour résultat une amélioration de la sensibilité de réception de la lumière du récepteur de faisceau. On dispose ainsi d'un dispositif de montage pour composants électroniques capable de détecter avec précision la hauteur de petits composants au moyen d'un détecteur photoélectrique relativement bon marché.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
US20090225304CN101218861