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1. (WO2007007617) SURFACE TREATMENT IN PRESENCE OF ORGANIC SOLVENT
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/007617 International Application No.: PCT/JP2006/313420
Publication Date: 18.01.2007 International Filing Date: 05.07.2006
IPC:
C25D 3/00 (2006.01) ,C23C 18/31 (2006.01) ,C23C 22/05 (2006.01) ,C25C 1/00 (2006.01) ,C25D 1/00 (2006.01) ,C25D 11/02 (2006.01) ,C25D 13/00 (2006.01) ,C25F 3/16 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18
Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16
by reduction or substitution, i.e. electroless plating
31
Coating with metals
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
22
Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
05
using aqueous solutions
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
C
PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
1
Electrolytic production, recovery or refining of metals by electrolysis of solutions
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
1
Electroforming
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
11
Electrolytic coating by surface reaction, i.e. forming conversion layers
02
Anodisation
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
13
Electrophoretic coating
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
F
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
3
Electrolytic etching or polishing
16
Polishing
Applicants:
ダイキン工業株式会社 DAIKIN INDUSTRIES, LTD. [JP/JP]; 〒5308323 大阪府大阪市北区中崎西2丁目4番12号 梅田センタービル Osaka Umeda Center Building, 4-12, Nakazaki-Nishi 2-Chome, Kita-ku, Osaka-shi, Osaka 5308323, JP (AllExceptUS)
永井 隆文 NAGAI, Takabumi [JP/JP]; JP (UsOnly)
藤井 和久 FUJII, Kazuhisa [JP/JP]; JP (UsOnly)
浅井 英明 ASAI, Hideaki [JP/JP]; JP (UsOnly)
Inventors:
永井 隆文 NAGAI, Takabumi; JP
藤井 和久 FUJII, Kazuhisa; JP
浅井 英明 ASAI, Hideaki; JP
Agent:
三枝 英二 SAEGUSA, Eiji; 〒5410045 大阪府大阪市中央区道修町1-7-1 北浜TNKビル Osaka Kitahama TNK Building, 1-7-1, Doshomachi, Chuo-ku Osaka-shi, Osaka 5410045, JP
Priority Data:
2005-19992708.07.2005JP
Title (EN) SURFACE TREATMENT IN PRESENCE OF ORGANIC SOLVENT
(FR) TRAITEMENT DE SURFACE EN PRÉSENCE D’UN SOLVANT ORGANIQUE
(JA) 有機溶媒存在下での表面処理
Abstract:
(EN) In an electrochemical surface treatment, reduction of a metal waste liquid and formation of a high-quality metal film, which exhibits good adhesion and has no pinhole, are easily realized. Specifically disclosed is a surface treatment method characterized by subjecting an object to a surface treatment in the presence of both an aqueous solution containing a metal salt and a hydrophobic solvent. In this connection, the surface treatment is selected from electrolytic plating, chemical plating, electroforming, anodizing, electrolytic polishing, electrolytic processing, electrophoretic coating, electrolytic refining and chemical conversion coating.
(FR) La présente invention concerne, dans un traitement de surface électrochimique, la réduction de déchets métalliques sous forme liquide et la formation d’un film métallique de haute qualité présentant une bonne adhésion et dépourvu de piqûre, les deux opérations étant facilement réalisables. L’invention concerne précisément un procédé de traitement de surface caractérisé par la soumission d’un objet à un traitement de surface en présence à la fois d’une solution aqueuse contenant un sel métallique et d’un solvant hydrophobe. À cet égard, le traitement de surface est choisi parmi une finition galvanique, un dépôt chimique, un électroformage, une anodisation, un polissage électrolytique, un traitement électrolytique, un revêtement électrophorétique, un affinage électrolytique et un revêtement par traitement chimique.
(JA)  電気化学的表面処理において金属廃液の削減と、付き周りが良くピンホールの無い高品位な金属皮膜を、容易に実現させる。金属塩を含む水溶液と疎水性溶媒の共存下に被対象物に表面処理を行うことを特徴とし、ここで表面処理とは電解めっき、化学めっき、電鋳、陽極酸化、電解研磨、電解加工、電気泳動塗装、電解精錬および化成処理からなる群から選択される、表面処理方法。
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)