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1. (WO2007007544) PROBE CARD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/007544 International Application No.: PCT/JP2006/312790
Publication Date: 18.01.2007 International Filing Date: 27.06.2006
IPC:
H01L 21/66 (2006.01) ,G01R 1/073 (2006.01) ,G01R 31/26 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
66
Testing or measuring during manufacture or treatment
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1
Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02
General constructional details
06
Measuring leads; Measuring probes
067
Measuring probes
073
Multiple probes
G PHYSICS
01
MEASURING; TESTING
R
MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31
Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
26
Testing of individual semiconductor devices
Applicants:
東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP/JP]; 〒1078481 東京都港区赤坂五丁目3番6号 Tokyo 3-6, Akasaka 5-chome, Minato-ku, Tokyo 1078481, JP (AllExceptUS)
雨宮 貴 AMEMIYA, Takashi [JP/JP]; JP (UsOnly)
保坂 久富 HOSAKA, Hisatomi [JP/JP]; JP (UsOnly)
Inventors:
雨宮 貴 AMEMIYA, Takashi; JP
保坂 久富 HOSAKA, Hisatomi; JP
Agent:
金本 哲男 KANEMOTO, Tetsuo; 〒1620065 東京都新宿区住吉町1-12 新宿曙橋ビル はづき国際特許事務所 Tokyo Hazuki International, Shinjuku Akebonobashi Building, 1-12, Sumiyoshi-cho, Shinjuku-ku, Tokyo 1620065, JP
Priority Data:
2005-20328512.07.2005JP
Title (EN) PROBE CARD
(FR) CARTE SONDE
(JA) プローブカード
Abstract:
(EN) [PROBLEMS] To stabilize the contact between probes and a wafer. [MEANS FOR SOLVING PROBLEMS] A probe card comprises a contactor for supporting probes and a printed circuit board electrically connected to the contactor. An elastic sheet is sandwiched between the contactor and printed circuit board. The elastic sheet is so formed that its elasticity becomes smaller on the center of the contactor than on the periphery. The elastic reaction force acting on the contactor from the elastic sheet when the elastic sheet is compressed is smaller on the center of the contactor than on the periphery. This reduces the amount of warp at the central part of the contactor, where the maximum warp occurs because it is remote from the fixed end, so that the flatness of the contactor can be maintained.
(FR) L’invention entend stabiliser le contact entre des sondes et une galette. L’invention concerne une carte sonde comprenant un contacteur afin de supporter des sondes et une carte de circuit imprimé connectée électriquement au contacteur. Une feuille élastique est prise en sandwich entre le contacteur et la carte de circuit imprimé. La feuille élastique est formée de façon à ce que son élasticité devienne plus faible au centre du contacteur qu’à la périphérie. La force de réaction élastique agissant sur le contacteur à partir de la feuille élastique lorsque la feuille élastique est comprimée est plus faible au centre du contacteur qu’à la périphérie. Ceci réduit la quantité de gauchissement au niveau de la partie centrale du contacteur, où la majorité du gauchissement se produit parce qu’elle est éloignée de l’extrémité fixe, ce qui permet de conserver la planéité du contacteur.
(JA) 【課題】ウェハとプローブとの接触を安定させる。 【解決手段】プローブカードは、プローブを支持するコンタクタと、コンタクタと電気的に接続されるプリント配線基板を備える。コンタクタとプリント配線基板との間には、弾性シートが介在される。弾性シートは、コンタクタの外周側よりも中央側の弾性が弱くなるように形成される。弾性シートが圧縮されたときに弾性シートからコンタクタに作用する弾性反力は、コンタクタの外周側に比べて中央部側が弱くなる。これにより、固定端から離れ最大に撓むコンタクタの中央部の撓み量が低減され、コンタクタの水平性が維持される。
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020070104531JP2007024533US20080150558