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1. (WO2007007534) SHEET PEELING APPARATUS AND SHEET PEELING METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/007534 International Application No.: PCT/JP2006/312688
Publication Date: 18.01.2007 International Filing Date: 26.06.2006
IPC:
H01L 21/683 (2006.01) ,H01L 21/301 (2006.01) ,H01L 21/304 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301
to subdivide a semiconductor body into separate parts, e.g. making partitions
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
Applicants:
リンテック株式会社 LINTEC CORPORATION [JP/JP]; 〒1730001 東京都板橋区本町23-23 Tokyo 23-23, Honcho, Itabashi-ku Tokyo 1730001, JP (AllExceptUS)
野中英明 NONAKA, Hideaki [JP/JP]; JP (UsOnly)
中田 幹 NAKATA, Kan [JP/JP]; JP (UsOnly)
小林賢治 KOBAYASHI, Kenji [JP/JP]; JP (UsOnly)
Inventors:
野中英明 NONAKA, Hideaki; JP
中田 幹 NAKATA, Kan; JP
小林賢治 KOBAYASHI, Kenji; JP
Agent:
山口義雄 YAMAGUCHI, Yoshio; 〒2060034 東京都多摩市鶴牧1丁目4番17号 いずみビル8F Tokyo 8th Floor, Izumi Building 4-17, Tsurumaki 1-chome Tama-shi, Tokyo 206-0034, JP
Priority Data:
2005-19880907.07.2005JP
Title (EN) SHEET PEELING APPARATUS AND SHEET PEELING METHOD
(FR) APPAREIL DE SÉPARATION DE FEUILLE ET PROCÉDÉ DE SÉPARATION DE FEUILLE
(JA) シート剥離装置及び剥離方法
Abstract:
(EN) A sheet peeling apparatus is provided for peeling an unnecessary adhesive sheet (S1) positioned on an outer side by cutting an adhesive sheet (S) along an outer periphery of a wafer (W) supported on an upper plane of a table (13), after adhering the adhesive sheet (S) on a plane of the wafer (W). The peeling apparatus is provided with a small diameter roller (70) which sandwiches the adhesive sheet (S) with the wafer (W), and a large diameter roller (71) for sandwiching the adhesive sheet (S) with the small diameter roller (70), and the unnecessary adhesive sheet (S1) is peeled by shift of the rollers (70, 71) along the table (13).
(FR) L’invention concerne un appareil de séparation de feuille permettant de séparer une feuille adhésive superflue (S1) positionnée sur un côté externe en découpant une feuille adhésive (S) le long de la périphérie externe d’une galette (W) supportée sur un plan supérieur d’une table (13), après avoir collé la feuille adhésive (S) sur un plan de la galette (W). L’appareil de séparation est muni d’un galet de petit diamètre (70) qui prend en sandwich la feuille adhésive (S) avec la galette (W) et d’un galet de grand diamètre (71) pour prendre en sandwich la feuille adhésive (S) avec le galet de petit diamètre (70), et la feuille adhésive superflue (S1) est séparée par le déplacement des galets (70, 71) le long de la table (13).
(JA) not available
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)