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Machine translation
1. (WO2007007531) SHEET ADHERING APPARATUS AND SHEET ADHERING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/007531    International Application No.:    PCT/JP2006/312685
Publication Date: 18.01.2007 International Filing Date: 26.06.2006
IPC:
H01L 21/683 (2006.01)
Applicants: LINTEC CORPORATION [JP/JP]; 23-23, Honcho, Itabashi-ku Tokyo 1730001 (JP) (For All Designated States Except US).
NONAKA, Hideaki [JP/JP]; (JP) (For US Only).
NAKATA, Kan [JP/JP]; (JP) (For US Only).
KOBAYASHI, Kenji [JP/JP]; (JP) (For US Only)
Inventors: NONAKA, Hideaki; (JP).
NAKATA, Kan; (JP).
KOBAYASHI, Kenji; (JP)
Agent: YAMAGUCHI, Yoshio; 8th Floor, Izumi Building, 4-17, Tsurumaki 1-chome, Tama-shi Tokyo 2060034 (JP)
Priority Data:
2005-198806 07.07.2005 JP
Title (EN) SHEET ADHERING APPARATUS AND SHEET ADHERING METHOD
(FR) APPAREIL DE COLLAGE DE FEUILLE ET PROCÉDÉ DE COLLAGE DE FEUILLE
(JA) シート貼付装置及び貼付方法
Abstract: front page image
(EN)A sheet adhering apparatus (10) is provided with a sheet feeding unit (12) for feeding an adhesive sheet (S) to a position where a plane of a semiconductor wafer (W) faces, and a pressing roller (14) for adhering the adhesive sheet (S) to the wafer (W) by applying a pressing force to the adhesive sheet (S). The sheet feeding unit (12) includes a tension measuring means (35) for measuring tension of the adhesive sheet (S) between a feeding head (49) and the pressing roller (14), and mixing of bubbles between the adhesive sheet (S) and the wafer (W), and wafer warping deformation after sheet adhesion are prevented by maintaining the tension fixed by the tension measuring means (35).
(FR)L’invention concerne un appareil de collage de feuille (10) muni d’une unité d'alimentation de feuille (12) permettant d'alimenter une feuille adhésive (S) en une position à laquelle fait face un plan de galette semi-conductrice (W), et d'un galet de pression (14) permettant de coller la feuille adhésive (S) à la galette (W) en appliquant une force de pression à la feuille adhésive (S). L’unité d'alimentation de feuille (12) comporte un moyen de mesure de tension (35) afin de mesurer la tension de la feuille adhésive (S) entre une tête d’injection (49) et le galet de pression (14), et le mélange de bulles entre la feuille adhésive (S) et la galette (W), tout comme le gauchissement de la galette après collage de la feuille sont évites en maintenant la tension fixée par le moyen de mesure de tension (35).
(JA)not available
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)