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1. (WO2007007233) PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/007233 International Application No.: PCT/IB2006/052243
Publication Date: 18.01.2007 International Filing Date: 04.07.2006
IPC:
H01L 23/498 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
Applicants:
KONINKLIJKE PHILIPS ELECTRONICS N.V. [NL/NL]; Groenewoudseweg 1 NL-5621 BA Eindhoven, NL (AllExceptUS)
WEEKAMP, Johannes, W. [NL/NL]; NL (UsOnly)
VAN VEEN, Nicolaas, J., A. [NL/NL]; NL (UsOnly)
Inventors:
WEEKAMP, Johannes, W.; NL
VAN VEEN, Nicolaas, J., A.; NL
Agent:
NOLLEN, Maarten, D-J.; Prof. Holstlaan 6 NL-5656 AA Eindhoven, NL
Priority Data:
05106169.507.07.2005EP
Title (EN) PACKAGE, METHOD OF MANUFACTURING THE SAME AND USE THEREOF
(FR) BOITIER, SON PROCEDE DE FABRICATION ET D'UTILISATION
Abstract:
(EN) The flexible package (100) comprises coupling means (20) for electrical coupling to an external component, a chip (30) with contact pads (32) that face the coupling means (20) and are electrically coupled thereto, and an electrically insulating encapsulation (40) encapsulating the chip (30) and being attached to the coupling means (20), said encapsulation (40) and said coupling means (20) constituting a substrate for the chip (30). The package (100) further comprises means (50) for handling the package (100). This means (50) is mechanically connected to the coupling means (20) through the encapsulation (40) only. The package (100) is suitable for assembly to a foil, which may be attached to or integrated in an article such as a security paper.
(FR) Selon l'invention, un boîtier flexible (100) comprend un dispositif de couplage (20) conçu pour se coupler électriquement à un composant externe, une puce (30) pourvue de plages de contact (32) situées face au dispositif de couplage (20) et couplées électriquement audit dispositif, et une encapsulation d'isolation électrique (40) encapsulant la puce (30) et rattachée au dispositif de couplage (20), ladite encapsulation (40) et ledit dispositif de couplage (20) constituant un substrat pour la puce (30). Ce boîtier (100) présente aussi un dispositif (50) pour la manipulation du boîtier (100). Ledit dispositif (50) est connecté mécaniquement au dispositif de couplage (20) uniquement par l'intermédiaire de l'encapsulation (40). Le boîtier (100) est approprié pour être assemblé à une feuille qui peut être attachée ou intégrée dans un article, tel qu'un papier de sécurité.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080023721EP1905079JP2008545265US20100140778CN101218674