WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2007006633) USE OF HEAT-ACTIVATED ADHESIVE FOR MANUFACTURE AND A DEVICE SO MANUFACTURED
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/006633    International Application No.:    PCT/EP2006/063467
Publication Date: 18.01.2007 International Filing Date: 22.06.2006
IPC:
H01R 4/04 (2006.01), H05K 3/32 (2006.01), H01B 1/22 (2006.01), C09J 9/02 (2006.01)
Applicants: CYPAK AB [SE/SE]; Box 2332, SE-103 18 Stockholm (SE) (For All Designated States Except US).
EHRENSVÄRD, Jakob [SE/SE]; (SE) (For US Only).
ERIKSSON, Leif Henrik [SE/SE]; (SE) (For US Only).
LINDMAN, Vilhelm [SE/SE]; (SE) (For US Only)
Inventors: EHRENSVÄRD, Jakob; (SE).
ERIKSSON, Leif Henrik; (SE).
LINDMAN, Vilhelm; (SE)
Agent: GIAVARINI, Francesco; Via Melchiorre Gioia, 64, I-20125 Milano (IT)
Priority Data:
60/697,370 08.07.2005 US
Title (EN) USE OF HEAT-ACTIVATED ADHESIVE FOR MANUFACTURE AND A DEVICE SO MANUFACTURED
(FR) UTILISATION D'UN ADHESIF ACTIVE PAR LA CHALEUR POUR FABRIQUER UN DISPOSITIF ET DISPOSITIF AINSI FABRIQUE
Abstract: front page image
(EN)The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.
(FR)L'invention concerne l'utilisation d'un adhésif activé par la chaleur destiné à fabriquer des dispositifs intelligents. Ces dispositifs comprennent un système électronique conducteur imprimé appliqué sur un substrat souple. L'adhésif est un adhésif électriquement conducteur anisotrope qui est appliqué sur le substrat, en tant que film mince qui peut être utilisé pour des connexions électriques ou pour fournir une stabilité mécanique au système conducteur imprimé.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)