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1. (WO2007006633) USE OF HEAT-ACTIVATED ADHESIVE FOR MANUFACTURE AND A DEVICE SO MANUFACTURED
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/006633 International Application No.: PCT/EP2006/063467
Publication Date: 18.01.2007 International Filing Date: 22.06.2006
IPC:
H01R 4/04 (2006.01) ,H05K 3/32 (2006.01) ,H01B 1/22 (2006.01) ,C09J 9/02 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
R
ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4
Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
04
using electrically conductive adhesives
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
32
electrically connecting electric components or wires to printed circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9
Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02
Electrically-conducting adhesives
Applicants:
CYPAK AB [SE/SE]; Box 2332 SE-103 18 Stockholm, SE (AllExceptUS)
EHRENSVÄRD, Jakob [SE/SE]; SE (UsOnly)
ERIKSSON, Leif Henrik [SE/SE]; SE (UsOnly)
LINDMAN, Vilhelm [SE/SE]; SE (UsOnly)
Inventors:
EHRENSVÄRD, Jakob; SE
ERIKSSON, Leif Henrik; SE
LINDMAN, Vilhelm; SE
Agent:
GIAVARINI, Francesco ; Via Melchiorre Gioia, 64 I-20125 Milano, IT
Priority Data:
60/697,37008.07.2005US
Title (EN) USE OF HEAT-ACTIVATED ADHESIVE FOR MANUFACTURE AND A DEVICE SO MANUFACTURED
(FR) UTILISATION D'UN ADHESIF ACTIVE PAR LA CHALEUR POUR FABRIQUER UN DISPOSITIF ET DISPOSITIF AINSI FABRIQUE
Abstract:
(EN) The invention is based on use of a heat-activated adhesive for manufacturing of intelligent devices comprising printed conductive electronics on a flexible substrate, where the adhesive is an anisotropic electrically conductive adhesive and is applied to the substrate as a thin film which can be used for electrical connections and for providing mechanical stability to the printed conductive electronics.
(FR) L'invention concerne l'utilisation d'un adhésif activé par la chaleur destiné à fabriquer des dispositifs intelligents. Ces dispositifs comprennent un système électronique conducteur imprimé appliqué sur un substrat souple. L'adhésif est un adhésif électriquement conducteur anisotrope qui est appliqué sur le substrat, en tant que film mince qui peut être utilisé pour des connexions électriques ou pour fournir une stabilité mécanique au système conducteur imprimé.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1902493US20080191174