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1. (WO2007006378) OPTOELECTRONIC COMPONENTS COMPRISING ADHESIVE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/006378 International Application No.: PCT/EP2006/005506
Publication Date: 18.01.2007 International Filing Date: 08.06.2006
Chapter 2 Demand Filed: 30.01.2007
IPC:
H01L 31/0203 (2006.01) ,H01L 31/0216 (2006.01) ,H01L 33/52 (2010.01) ,H01L 33/44 (2010.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0203
Containers; Encapsulations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0216
Coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
44
characterised by the coatings, e.g. passivation layer or anti-reflective coating
Applicants:
TRIDONIC OPTOELECTRONICS GMBH [AT/AT]; Technologiepark 10 A-8380 Jennersdorf, AT (AllExceptUS)
LUMITECH PRODUKTION UND ENTWICKLUNG GMBH [AT/AT]; Technologiepark 10 8380 Jennersdorf, AT (AllExceptUS)
SCHRANK, Franz [AT/AT]; AT (UsOnly)
PACHLER, Peter [AT/AT]; AT (UsOnly)
Inventors:
SCHRANK, Franz; AT
PACHLER, Peter; AT
Agent:
RUPP, Christian; Mitscherlich & Partner Patent & Rechtsanwälte Postfach 33 06 09 80066 München, DE
Priority Data:
10 2005 032 078.308.07.2005DE
10 2005 038 698.916.08.2005DE
Title (DE) OPTOELEKTRONISCHE BAUELEMENTE MIT HAFTVERMITTLER
(EN) OPTOELECTRONIC COMPONENTS COMPRISING ADHESIVE
(FR) COMPOSANTS OPTOELECTRONIQUES A PROMOTEUR D'ADHERENCE
Abstract:
(DE) SiO2-Schichten werden als Haftschichten bei optoelektronischen Komponenten eingesetzt. Es können dauerhafte Verklebungen mit Silikonkautschuken hergestellt werden. Diese Materialien haben üblicherweise nur eine unzureichende Haftfestigkeit auf Materialien, wie sie häufig für optoelektronische Komponenten, wie z.B. LED Modulen, eingesetzt werden. Dies führt dann in weiterer Folge zu einer deutlichen Verminderung der Lebensdauer der gefertigten Komponenten. Durch den Einsatz der Haftschichten (600, 601) werden diese Einschränkungen wirkungsvoll vermieden, die Beständigkeit bei Betrieb in feuchter Umgebung und bei Temperaturwechselbelastung wird wesentlich verbessert.
(EN) SiO2 layers are used as adhesive layers in optoelectronic components. Permanent glued connections can be established with silicone rubbers. Said materials are usually provided with insufficient adhesion on materials that are frequently used for optoelectronic components, such as LED modules, resulting in a significant reduction of the service life of the components produced. Using the inventive adhesive layers (600, 601) makes it possible to effectively overcome said limitations while the resistance of the components during operation in a humid environment or during stresses caused by changes in temperature is substantially improved.
(FR) L'invention concerne des couches de SiO2 utilisées comme couches adhésives dans des composants optoélectroniques. Des collages durables peuvent être réalisés au moyen de caoutchoucs de silicone. Habituellement, ces matériaux ne présentent qu'une adhésivité insuffisante sur des matériaux tels qu'ils sont souvent utilisés pour des composants optoélectroniques, p. ex. des modules LED, ce qui a pour conséquence de diminuer sensiblement la durée de vie des composants fabriqués. Grâce à l'utilisation des couches adhésives (600, 601), ces limitations sont efficacement évitées et la stabilité des composants est sensiblement améliorée lorsqu'ils fonctionnent en milieu humide et sont soumis à des variations de température.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)
Also published as:
KR1020080030056EP1902478JP2009500834US20080203413CN101218689CA2614208