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Pub. No.:    WO/2007/005823    International Application No.:    PCT/US2006/025965
Publication Date: 11.01.2007 International Filing Date: 30.06.2006
H01L 21/44 (2006.01), H01L 21/46 (2006.01), H01L 21/48 (2006.01), H01L 21/50 (2006.01), H01L 21/78 (2006.01), H01L 21/301 (2006.01)
Applicants: TEXAS INSTRUMENTS INCORPORATED [US/US]; P.O. Box 655474, Mail Station 3999, Dallas, TX 75265-5474 (US) (For All Designated States Except US).
HARRIS, John, Paul, Jr. [US/US]; (US) (For US Only)
Inventors: HARRIS, John, Paul, Jr.; (US)
Agent: FRANZ, Warren, L.; TEXAS INSTRUMENTS INCOPORATED, Deputy General Patent Counsel, P.O. Box 655474, M/S 3999, Dallas, TX 75265-5474 (US)
Priority Data:
11/172,975 01.07.2005 US
Abstract: front page image
(EN)The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device singulation includes a step of sawing kerfs approximately coinciding with the peripheries of numerous devices arranged on a wafer. Kerfs are also sawn into the opposite side of the wafer approximately opposing the first kerfs. Mechanical stress is applied to the wafer causing controlled breakage of the intervening wafer material, severing each of the devices from its neighbors. A saw blade (30) apparatus of the invention provides enhanced cutting characteristics and is particularly suited for glass-bonded semiconductor wafer device singulation. The saw blade has a diamond disc (32) suitable for high-speed rotation about its axis. The saw blade of the invention also preferably has a radiused cutting edge (36), and an annular gutter symmetrically disposed about the circumference on each of the opposing planes of the disc.
(FR)L'invention concerne un appareil et des proc�d�s de sciage et ds�paration de dispositifs individuels d'une tranche � semi-conducteurs faite de silicium ou de verre. La s�paration des dispositifs de la tranche selon les proc�d�s de l'invention consiste � former des entailles co�ncidant approximativement avec les contours des nombreux dispositifs form�s sur la tranche. D'autres entailles sont �galement form�es sur le c�t� oppos� de la tranche face aux premi�res entailles. Une contrainte m�canique est appliqu�e sla tranche, provoquant la cassure contr�l�e du mat�riau actif la tranche, s�parant chaque dispositif de ses voisins. L'appareil � lame (30) de scie de l'invention pr�sente des caract�ristiques de coupe am�lior�es, et est particuli�rement adapt� pour la s�paration de dispositifs d'une tranche � semi-conducteurs form�e dverre. La lame de scie pr�sente un disque (32) en diamant adapt pour une rotation � vitesse �lev�e autour de son axe. La lame scie de l'invention pr�sente �galement, de pr�f�rence, un bord tranchant arrondi (36), et un logement de bavure annulaire dispos�de fa�on sym�trique autour de la circonf�rence sur chacun des plans oppos�s du disque.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)