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Machine translation
1. (WO2007005695) INTEGRATED CIRCUIT DIE CONTAINING METAL- AND PARTICLE-FILLED THROUGH-SILICON VIAS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/005695    International Application No.:    PCT/US2006/025748
Publication Date: 11.01.2007 International Filing Date: 29.06.2006
IPC:
H01L 23/48 (2006.01), H01L 21/768 (2006.01)
Applicants: INTEL CORPORATION [US/US]; 2200 Mission College Boulevard, Santa Clara, CA 95052 (US) (For All Designated States Except US).
ARANA, Leonel [US/US]; (US) (For US Only).
NEWMAN, Michael [US/US]; (US) (For US Only).
NATEKAR, Devendra [IN/US]; (US) (For US Only)
Inventors: ARANA, Leonel; (US).
NEWMAN, Michael; (US).
NATEKAR, Devendra; (US)
Agent: MALLIE, Michael, J.; Blakely, Sokoloff, Taylor & Zafman LLP, 12400 Wilshire Boulevard, 7th Floor, Los Angeles, CA 90025 (US)
Priority Data:
11/174,125 30.06.2005 US
Title (EN) INTEGRATED CIRCUIT DIE CONTAINING METAL- AND PARTICLE-FILLED THROUGH-SILICON VIAS
(FR) MATRICE DE CIRCUIT INTÉGRÉ CONTENANT DES TROUS DE LIAISON DE SUBSTRATS EN SILICIUM REMPLIS DE MÉTAL ET DE PARTICULES
Abstract: front page image
(EN)A method, apparatus and system with an electrically conductive through hole via of a composite material with a matrix forming a continuous phase and embedded particles, with a different material property than the matrix, forming a dispersed phase, the resulting composite material having a different material property than the matrix.
(FR)La présente invention concerne un procédé, un dispositif et un système présentant un trou de liaison conducteur d’un matériau composite à matrice formant une phase continue et des particules intégrées, dotées d’une propriété matérielle différente de la matrice, formant une phase dispersée, le matériau composite résultant étant doté d’une propriété matérielle différente de la matrice.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)