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1. (WO2007005592) ELECTROMIGRATION-RESISTANT AND COMPLIANT WIRE INTERCONNECTS, NANO-SIZED SOLDER COMPOSITIONS, SYSTEMS MADE THEREOF, AND METHODS OF ASSEMBLING SOLDERED PACKAGES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/005592 International Application No.: PCT/US2006/025548
Publication Date: 11.01.2007 International Filing Date: 30.06.2006
IPC:
H01L 23/498 (2006.01) ,H01L 21/48 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
48
Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/06-H01L21/326201
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Blvd. Santa Clara, California 95052, US (AllExceptUS)
HUA, Fay [US/US]; US (UsOnly)
Inventors:
HUA, Fay; US
Agent:
MCCRACKIN, Ann M ; Schwegman, Lundberg & Woessner, P.A. P.O. Box 2938 Minneapolis, Minnesota 55402, US
Priority Data:
11/173,93930.06.2005US
Title (EN) ELECTROMIGRATION-RESISTANT AND COMPLIANT WIRE INTERCONNECTS, NANO-SIZED SOLDER COMPOSITIONS, SYSTEMS MADE THEREOF, AND METHODS OF ASSEMBLING SOLDERED PACKAGES
(FR) INTERCONNEXIONS A FILS FLEXIBLES RESISTANTES A L'ELECTROMIGRATION, COMPOSITIONS DE SOUDURE NANOMETRIQUES, SYSTEMES REALISES AVEC CES COMPOSITIONS, ET PROCEDES DE MONTAGE DE BOITIERS SOUDES
Abstract:
(EN) A nano-sized metal particle composite includes a first metal that has a particle size of about 50 nanometer or smaller. A wire interconnect is in contact with a reflowed nanosolder and has the same metal or alloy composition as the reflowed nanosolder. A microelectronic package is also disclosed that uses the reflowed nanosolder composition. A method of assembling a microelectronic package includes preparing a wire interconnect template. A computing system includes a nanosolder composition coupled to a wire interconnect.
(FR) L'invention concerne un composite à base de particules de métal nanométriques, qui comprend un premier métal dont la granulométrie est d'au plus environ 50 nanomètres. Une interconnexion à fil est en contact avec une nanosoudure réalisée par refusion et présente le même métal ou la même composition alliée que la nanosoudure réalisée par refusion. On décrit un boîtier micro-électronique utilisant la composition de nanosoudure réalisée par refusion. Un procédé de montage d'un boîtier micro-électronique consiste à préparer un gabarit d'interconnexion à fil. Un système informatique comprend une composition de nanosoudure couplée à une interconnexion à fil.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080015480KR1020100028121EP1897137JP2008545257CN101208799KR1020120002614
KR1020120125556