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Machine translation
1. (WO2007005379) REDUCTION OF HEAT LOSS IN MICRO-FLUID EJECTION DEVICES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/005379    International Application No.:    PCT/US2006/024829
Publication Date: 11.01.2007 International Filing Date: 23.06.2006
IPC:
B41J 2/05 (2006.01)
Applicants: LEXMARK INTERNATIONAL, INC. [US/US]; 740 West Circle Road, Lexington, KY 40550 (US) (For All Designated States Except US).
BELL, Byron, V. [US/US]; (US) (For US Only).
CORNELL, Robert, W. [US/US]; (US) (For US Only).
GUAN, Yimin [CN/US]; (US) (For US Only).
JOYNER, Burton, L. [US/US]; (US) (For US Only)
Inventors: BELL, Byron, V.; (US).
CORNELL, Robert, W.; (US).
GUAN, Yimin; (US).
JOYNER, Burton, L.; (US)
Agent: BARKER, Scott, N.; LEXMARK INTERNATIONAL, INC., 740 West New Circle Road, Lexington, KY 40509 (US)
Priority Data:
11/170,894 30.06.2005 US
Title (EN) REDUCTION OF HEAT LOSS IN MICRO-FLUID EJECTION DEVICES
(FR) REDUCTION DE PERTE DE CHALEUR DANS DES DISPOSITIFS D'EJECTION MICROFLUIDIQUE
Abstract: front page image
(EN)The present disclosure is directed to a micro-fluid ejection head for a microfluid ejection device. The head includes a semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator. The substrate further includes a thermal insulating barrier layer between the semiconductor substrate and the fluid ejection actuator. The thermal insulating barrier layer includes a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.
(FR)L'invention concerne une tête d'éjection microfluidique destinée à un dispositif d'éjection microfluidique. Ladite tête comprend un substrat semi-conducteur, un actionneur d'éjection fluidique supporté par le substrat semi-conducteur, un élément de buse présentant des trous de buse fixé au substrat afin d'expulser les gouttelettes de fluide provenant d'un ou de plusieurs trou(s) dans l'élément de buse lors de l'activation de l'actionneur d'éjection. Le substrat comprend également une couche barrière d'isolation thermique disposée entre le substrat semi-conducteur et l'actionneur d'éjection fluidique. La couche barrière d'isolation thermique comprend un matériau poreux sensiblement imperméable à conductivité thermique inférieure à environ 1 W/m-K.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)