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1. (WO2007005379) REDUCTION OF HEAT LOSS IN MICRO-FLUID EJECTION DEVICES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/005379 International Application No.: PCT/US2006/024829
Publication Date: 11.01.2007 International Filing Date: 23.06.2006
IPC:
B41J 2/05 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
J
TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
2
Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
005
characterised by bringing liquid or particles selectively into contact with a printing material
01
Ink jet
015
characterised by the jet generation process
04
generating single droplets or particles on demand
045
by pressure, e.g. electromechanical transducers
05
produced by the application of heat
Applicants:
LEXMARK INTERNATIONAL, INC. [US/US]; 740 West Circle Road Lexington, KY 40550, US (AllExceptUS)
BELL, Byron, V. [US/US]; US (UsOnly)
CORNELL, Robert, W. [US/US]; US (UsOnly)
GUAN, Yimin [CN/US]; US (UsOnly)
JOYNER, Burton, L. [US/US]; US (UsOnly)
Inventors:
BELL, Byron, V.; US
CORNELL, Robert, W.; US
GUAN, Yimin; US
JOYNER, Burton, L.; US
Agent:
BARKER, Scott, N.; LEXMARK INTERNATIONAL, INC. 740 West New Circle Road Lexington, KY 40509, US
Priority Data:
11/170,89430.06.2005US
Title (EN) REDUCTION OF HEAT LOSS IN MICRO-FLUID EJECTION DEVICES
(FR) REDUCTION DE PERTE DE CHALEUR DANS DES DISPOSITIFS D'EJECTION MICROFLUIDIQUE
Abstract:
(EN) The present disclosure is directed to a micro-fluid ejection head for a microfluid ejection device. The head includes a semiconductor substrate, a fluid ejection actuator supported by the semiconductor substrate, a nozzle member containing nozzle holes attached to the substrate for expelling droplets of fluid from one or more nozzle holes in the nozzle member upon activation of the ejection actuator. The substrate further includes a thermal insulating barrier layer between the semiconductor substrate and the fluid ejection actuator. The thermal insulating barrier layer includes a porous, substantially impermeable material having a thermal conductivity of less than about 1 W/m-K.
(FR) L'invention concerne une tête d'éjection microfluidique destinée à un dispositif d'éjection microfluidique. Ladite tête comprend un substrat semi-conducteur, un actionneur d'éjection fluidique supporté par le substrat semi-conducteur, un élément de buse présentant des trous de buse fixé au substrat afin d'expulser les gouttelettes de fluide provenant d'un ou de plusieurs trou(s) dans l'élément de buse lors de l'activation de l'actionneur d'éjection. Le substrat comprend également une couche barrière d'isolation thermique disposée entre le substrat semi-conducteur et l'actionneur d'éjection fluidique. La couche barrière d'isolation thermique comprend un matériau poreux sensiblement imperméable à conductivité thermique inférieure à environ 1 W/m-K.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1954500CA2630028AU2006266142