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1. (WO2007005275) MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/005275    International Application No.:    PCT/US2006/023957
Publication Date: 11.01.2007 International Filing Date: 20.06.2006
IPC:
C08L 63/00 (2006.01), C08L 71/12 (2006.01), C08K 3/36 (2006.01), H01L 23/29 (2006.01)
Applicants: GENERAL ELECTRIC COMPANY [US/US]; (A NEW YORK CORPORATION), 1 River Road, Schenectady, NY 12345 (US) (For All Designated States Except US).
LU, Qiwei [CN/US]; (US) (For US Only).
O'BRIEN, Michael [US/US]; (US) (For US Only).
ROCHA-GALICIA, Gerardo [MX/US]; (US) (For US Only).
SUSARLA, Prameela [IN/US]; (US) (For US Only)
Inventors: LU, Qiwei; (US).
O'BRIEN, Michael; (US).
ROCHA-GALICIA, Gerardo; (US).
SUSARLA, Prameela; (US)
Agent: WINTER, Catherine, J.; GENERAL ELECTRIC COMPANY, Global Patent Operation, 187 Danbury Road, Suite 204, Wilton, CT 06897 (US)
Priority Data:
11/172,300 30.06.2005 US
Title (EN) MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE
(FR) COMPOSITION ET PROCEDE DE MOULAGE, ET ARTICLE MOULE
Abstract: front page image
(EN)A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
(FR)La présente invention se rapporte à une composition de moulage permettant encapsuler des dispositifs à semi-conducteur, qui contient une résine époxyde, un durcisseur, une résine de poly(arylène éther) renfermant moins de 5 % poids de particules d'une taille supérieure à 100 microns, et entre 70 et 95 % poids environ d'une charge de silice, sur la base du poids total de la composition. Après durcissement, la composition selon l'invention présente une adhérence au cuivre améliorée et un retrait réduit par rapport aux compositions de moulage classiques.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)