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1. (WO2007005267) BURIED CONDUCTOR FOR IMAGERS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/005267 International Application No.: PCT/US2006/023878
Publication Date: 11.01.2007 International Filing Date: 20.06.2006
IPC:
H01L 27/146 (2006.01) ,H01L 31/02 (2006.01) ,H01L 31/0224 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
14
including semiconductor components sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
144
Devices controlled by radiation
146
Imager structures
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
0224
Electrodes
Applicants:
MICRON TECHNOLOGY, INC. [US/US]; 8000 S. Federal Way Boise, ID 83707-0006, US (AllExceptUS)
RHODES, Howard, E. [US/US]; US (UsOnly)
Inventors:
RHODES, Howard, E.; US
Agent:
D'AMICO, Thomas, J.; Dickstein Shapiro Morin & Oshinsky LP 2101 L Street NW Washington, DC 20037-1526, US
Priority Data:
11/168,76029.06.2005US
Title (EN) BURIED CONDUCTOR FOR IMAGERS
(FR) CONDUCTEUR ENTERRE DESTINE A DES IMAGEURS
Abstract:
(EN) A pixel cell having (200) a photo-conversion device (21) at a surface of a substrate (11) and at least one contact area (277) from which charge or a signal is output or received. A first insulating layer (233) is located over the photo-conversion device and the at least one contact area. The pixel cell further includes at least one conductor in contact with the at least one contact area. The conductor includes a polysilicon material (271) extending through the first insulating layer and in contact with the at least one contact area. Further, a conductive material (272) , which includes at least one of a suicide and a refractory metal, can be over and in contact with the polysilicon material.
(FR) La présente invention concerne une cellule pixel (200) qui comprend un dispositif de photo-conversion (21) prévu sur une surface d'un substrat (11) et au moins une zone de contact (277) au niveau de laquelle une charge ou un signal est produit ou reçu. Une première couche isolante (233) est située au-dessus du dispositif de photo-conversion et de la ou des zones de contact. La cellule pixel comprend également au moins un conducteur en contact avec la ou les zones de contact. Le conducteur est formé d'un matériau en silicium polycristallin (271) qui s'étend dans la première couche isolante et qui se trouve en contact avec la ou les zones de contact. Un matériau conducteur (272) contenant au moins un siliciure et un métal réfractaire peut également être placé au-dessus du matériau en silicium polycristallin et en contact avec ce dernier.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080022225SG161295EP1897141JP2008545275CN101253630