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1. (WO2007004765) CONDUCTIVE PARTICLES COMPRISING COMPLEX METAL LAYER WITH DENSITY GRADIENT, METHOD FOR PREPARING THE PARTICLES, AND ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION COMPRISING THE PARTICLES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/004765 International Application No.: PCT/KR2005/002557
Publication Date: 11.01.2007 International Filing Date: 05.08.2005
IPC:
C08J 3/12 (2006.01)
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
3
Processes of treating or compounding macromolecular substances
12
Powdering or granulating
Applicants:
CHEIL INDUSTRIES INC. [KR/KR]; 290, Gongdan 2-dong Gumi-si Gyeongsangbuk-do 730-710, KR (AllExceptUS)
JUN, Jung Bae [KR/KR]; KR (UsOnly)
PARK, Jin Gyu [KR/KR]; KR (UsOnly)
LEE, Jae Ho [KR/KR]; KR (UsOnly)
BAE, Tae Sub [KR/KR]; KR (UsOnly)
PARK, Jung Il [KR/KR]; KR (UsOnly)
LEE, Sang Woon [KR/KR]; KR (UsOnly)
Inventors:
JUN, Jung Bae; KR
PARK, Jin Gyu; KR
LEE, Jae Ho; KR
BAE, Tae Sub; KR
PARK, Jung Il; KR
LEE, Sang Woon; KR
Agent:
PARK, Yong Soon; 2nd Floor Sangwon Bldg. 636-15 Yeoksam-dong Kangnam-ku Seoul 135-908, KR
Priority Data:
10-2005-006022505.07.2005KR
Title (EN) CONDUCTIVE PARTICLES COMPRISING COMPLEX METAL LAYER WITH DENSITY GRADIENT, METHOD FOR PREPARING THE PARTICLES, AND ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION COMPRISING THE PARTICLES
(FR) PARTICULES CONDUCTRICES COMPRENANT UNE COUCHE MÉTALLIQUE COMPLEXE AVEC UN GRADIENT DE DENSITÉ, PROCÉDÉ DE PRÉPARATION DES PARTICULES, ET COMPOSITION ADHÉSIVE CONDUCTRICE ANISOTROPE COMPRENANT LES PARTICULES
Abstract:
(EN) Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and consists of nickel (Ni) and gold (Au).
(FR) La présente invention concerne des particules conductrices présentant une fiabilité électrique supérieure qui sont utiles comme matériaux pour des structures de connexion électrique. La présente invention concerne en outre un procédé de préparation de particules conductrices comprenant des particules de base en résine polymère et une couche de placage métallique complexe conducteur à la surface des particules de base, la couche de placage métallique complexe conducteur présentant un gradient de densité sensiblement continu et étant constituée de nickel (Ni) et d'or (Au).
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
JP2009500804US20080102277CN101208377