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1. (WO2007004660) DEVICE WITH MOUNTED ELECTRONIC PARTS, METHOD OF PRODUCING THE SAME, PROTECTION CIRCUIT MODULE OF SECONDARY BATTERY, AND BATTERY PACKAGE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/004660 International Application No.: PCT/JP2006/313350
Publication Date: 11.01.2007 International Filing Date: 28.06.2006
IPC:
H05K 3/28 (2006.01) ,H01L 21/56 (2006.01) ,H01L 25/04 (2006.01) ,H01L 25/18 (2006.01) ,H01M 2/10 (2006.01) ,H05K 1/18 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
22
Secondary treatment of printed circuits
28
Applying non-metallic protective coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56
Encapsulations, e.g. encapsulating layers, coatings
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
M
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
2
Constructional details, or processes of manufacture, of the non-active parts
10
Mountings; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
18
Printed circuits structurally associated with non-printed electric components
Applicants:
RICOH COMPANY, LTD. [JP/JP]; 3-6, Nakamagome 1-chome, Ohta-ku, Tokyo 1438555, JP (AllExceptUS)
MORISHITA, Seiichi [JP/JP]; JP (UsOnly)
YAMADA, Hideki [JP/JP]; JP (UsOnly)
Inventors:
MORISHITA, Seiichi; JP
YAMADA, Hideki; JP
Agent:
ITOH, Tadahiko; 32nd Floor Yebisu Garden Place Tower 20-3, Ebisu 4-chome Shibuya-ku, Tokyo 1506032, JP
Priority Data:
2005-19460504.07.2005JP
Title (EN) DEVICE WITH MOUNTED ELECTRONIC PARTS, METHOD OF PRODUCING THE SAME, PROTECTION CIRCUIT MODULE OF SECONDARY BATTERY, AND BATTERY PACKAGE
(FR) DISPOSITIF AVEC DES PIECES ELECTRONIQUES MONTEES, PROCEDE DE PRODUCTION DE CELUI-CI, MODULE DE CIRCUIT DE PROTECTION DE BATTERIE SECONDAIRE ET BOITIER DE BATTERIE
Abstract:
(EN) A method of fabricating a device including plural electronic parts mounted on a circuit board with mounting areas for mounting the electronic parts being covered by a sealing resin is disclosed. The method prevents small air bubbles from entering into the sealing resin near the electronic parts. The method includes the steps of, before applying the sealing resin, applying an under-fill resin near the electronic parts with plural nozzles at the same time, and hardening the under-fill resin to form a taper-shaped structure around the electronic parts.
(FR) Procédé de fabrication d’un dispositif comprenant plusieurs pièces électroniques montées sur une carte de circuit avec des zones de montage pour monter les pièces électroniques recouvertes par une résine d'étanchéité. Le procédé empêche de petites bulles d'air d'entrer dans la résine d'étanchéité à proximité des pièces électroniques. Le procédé comprend les étapes consistant à, avant l'application de la résine d'étanchéité, appliquer une résine de remplissage à proximité des pièces électroniques avec plusieurs buses en même temps, et durcir la résine de remplissage pour former une structure effilée autour des pièces électroniques.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020070069142JP2007013019US20080017408CN101040573