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1. (WO2007004645) COPPER ALLOY FOR ELECTRONIC EQUIPMENT AND PROCESS FOR PRODUCING THE SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/004645 International Application No.: PCT/JP2006/313305
Publication Date: 11.01.2007 International Filing Date: 04.07.2006
IPC:
C22C 9/02 (2006.01) ,C22C 9/04 (2006.01) ,C22C 9/06 (2006.01) ,C22F 1/08 (2006.01) ,C22F 1/00 (2006.01) ,C22F 1/02 (2006.01)
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
02
with tin as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
04
with zinc as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
06
with nickel or cobalt as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08
of copper or alloys based thereon
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
F
CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1
Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
02
in inert or controlled atmosphere or vacuum
Applicants:
古河電気工業株式会社 THE FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 〒1008322 東京都千代田区丸の内2丁目2番3号 Tokyo 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP
Inventors:
宇野岳夫 UNO, Takeo; JP
菅原親人 SUGAWARA, Chikahito; JP
三原邦照 MIHARA, Kuniteru; JP
Agent:
飯田敏三 IIDA, Toshizo; 〒1050004 東京都港区新橋3丁目1番10号 石井ビル3階 Tokyo ISHII Bldg. 3F 1-10, Shimbashi 3-chome Minato-ku, Tokyo 1050004, JP
Priority Data:
2005-19572005.07.2005JP
Title (EN) COPPER ALLOY FOR ELECTRONIC EQUIPMENT AND PROCESS FOR PRODUCING THE SAME
(FR) ALLIAGE DE CUIVRE POUR COMPOSANT ÉLECTRONIQUE ET SON PROCÉDÉ DE PRODUCTION
(JA) 電子機器用銅合金及びその製造方法
Abstract:
(EN) A copper alloy for electronic equipment, characterized in that the work-affected layer constituting the surface layer thereof has a thickness of 0.2 μm or less; and a process for producing the same.
(FR) La présente invention concerne un alliage de cuivre pour composant électronique, qui se caractérise en ce que la couche de travail qui en constitue la couche de surface présente une épaisseur inférieure ou égale à 0,2 µm, et son procédé de production.
(JA)  表層の加工変質層の厚さが0.2μm以下であることを特徴とする電子機器用銅合金、およびその製造方法。  
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020080027818CN101213314