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1. (WO2007004581) Sn-PLATED COPPER ALLOY BAR HAVING EXCELLENT FATIGUE CHARACTERISTICS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/004581 International Application No.: PCT/JP2006/313134
Publication Date: 11.01.2007 International Filing Date: 30.06.2006
IPC:
C25D 3/30 (2006.01) ,C22C 9/00 (2006.01) ,C22C 9/02 (2006.01) ,C22C 9/04 (2006.01) ,C22C 9/06 (2006.01) ,C25D 5/50 (2006.01) ,C25D 7/00 (2006.01)
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
3
Electroplating; Baths therefor
02
from solutions
30
of tin
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
02
with tin as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
04
with zinc as the next major constituent
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
9
Alloys based on copper
06
with nickel or cobalt as the next major constituent
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48
After-treatment of electroplated surfaces
50
by heat-treatment
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7
Electroplating characterised by the article coated
Applicants:
日鉱金属株式会社 Nippon Mining & Metals Co., Ltd. [JP/JP]; 〒1050001 東京都港区虎ノ門二丁目10番1号 Tokyo 10-1, Toranomon 2-chome, Minato-ku, Tokyo 1050001, JP (AllExceptUS)
波多野 隆紹 HATANO, Takaaki [JP/JP]; JP (UsOnly)
Inventors:
波多野 隆紹 HATANO, Takaaki; JP
Agent:
倉内 基弘 KURAUCHI, Motohiro; 〒1030027 東京都中央区日本橋3丁目13番11号油脂工業会館 Tokyo Yushi Kogyo Kaikan 13-11, Nihonbashi 3-chome Chuo-ku, Tokyo 1030027, JP
Priority Data:
2005-19293930.06.2005JP
Title (EN) Sn-PLATED COPPER ALLOY BAR HAVING EXCELLENT FATIGUE CHARACTERISTICS
(FR) BARRE EN ALLIAGE DE CUIVRE ÉTAMÉ AYANT D'EXCELLENTES CARACTÉRISTIQUES DE TENUE EN FATIGUE
(JA) 疲労特性に優れる銅合金Snめっき条
Abstract:
(EN) Disclosed is an Sn-plated copper alloy bar having good fatigue characteristics wherein deterioration of fatigue characteristics due to Sn plating is prevented. In a copper alloy bar which is provided with an Sn or Sn alloy plating film by electroplating or reflow processing, fatigue characteristics are improved by setting the average hydrogen concentration at about 2 mass ppm or less.
(FR) La présente invention concerne une barre en alliage de cuivre étamé ayant de bonnes caractéristiques de tenue en fatigue, la détérioration des caractéristiques de tenue en fatigue provoquée par l'étamage étant évitée. Dans une barre en alliage de cuivre qui est pourvue d'un film d'étamage à l'étain ou à alliage d'étain par galvanoplastie ou traitement par refusion, les caractéristiques de tenue en fatigue sont améliorées en réglant la concentration moyenne en hydrogène à une valeur inférieure ou égale à environ 2 ppm en masse.
(JA)  Snめっきによる疲労特性の劣化を防止することにより、良好な疲労特性を有するSnめっき銅合金条を提供する。  電気めっきおよびリフロー処理によりSnまたはSn合金めっき皮膜が形成された銅合金条において、平均水素濃度を約2質量ppm以下にすることにより疲労特性を改善する。
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020080011703JPWO2007004581US20090130480CN101203631JP4850178