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1. (WO2007004569) PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/004569    International Application No.:    PCT/JP2006/313114
Publication Date: 11.01.2007 International Filing Date: 30.06.2006
IPC:
G03F 7/037 (2006.01), C09J 7/00 (2006.01), C09J 179/08 (2006.01), G03F 7/004 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 1-1, Nishi-Shinjuku 2-chome, Shinjuku-ku, Tokyo 1630449 (JP) (For All Designated States Except US).
KAWAMORI, Takashi [JP/JP]; (JP) (For US Only).
MASUKO, Takashi [JP/JP]; (JP) (For US Only).
KATOGI, Shigeki [JP/JP]; (JP) (For US Only).
YASUDA, Masaaki [JP/JP]; (JP) (For US Only)
Inventors: KAWAMORI, Takashi; (JP).
MASUKO, Takashi; (JP).
KATOGI, Shigeki; (JP).
YASUDA, Masaaki; (JP)
Agent: HASEGAWA, Yoshiki; SOEI PATENT AND LAW FIRM Ginza First Bldg. 10-6, Ginza 1-chome Chuo-ku, Tokyo 104-0061 (JP)
Priority Data:
2005-196328 05.07.2005 JP
2005-332955 17.11.2005 JP
Title (EN) PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART
(FR) COMPOSITION ADHÉSIVE PHOTOSENSIBLE ET FILM ADHÉSIF, FEUILLE ADHÉSIVE, TRANCHE DE SEMI-CONDUCTEUR AVEC COUCHE ADHÉSIVE, DISPOSITIF SEMI-CONDUCTEUR ET PIÈCE ÉLECTRONIQUE OBTENUS EN UTILISANT CETTE COMPOSITION
(JA) 感光性接着剤組成物、並びにこれを用いて得られる接着フィルム、接着シート、接着剤層付半導体ウェハ、半導体装置及び電子部品
Abstract: front page image
(EN)A photosensitive adhesive composition comprising (A) polyimide of 80 to 180 mg/KOH acid value having carboxyl as a side chain, (B) radiation-polymerizable compound and (C) photopolymerization initiator.
(FR)La présente invention concerne une composition adhésive photosensible comprenant (A) un polyimide ayant un indice d'acide de 80 à 180 mg de KOH et comportant une chaîne latérale carboxyle, (B) un composé polymérisable par rayonnement et (C) un initiateur de photopolymérisation.
(JA)(A)カルボキシル基を側鎖として有し、酸価が80~180mg/KOHであるポリイミドと、(B)放射線重合性化合物と、(C)光重合開始剤とを含有する感光性接着剤組成物。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)