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1. (WO2007004345) PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/004345 International Application No.: PCT/JP2006/308093
Publication Date: 11.01.2007 International Filing Date: 18.04.2006
IPC:
G03F 7/085 (2006.01) ,G03F 7/075 (2006.01) ,C08K 5/544 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
085
Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
075
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
544
containing nitrogen
Applicants:
東レ株式会社 TORAY INDUSTRIES, INC. [JP/JP]; 〒1038666 東京都中央区日本橋室町2丁目1番1号 Tokyo 1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo 1038666, JP (AllExceptUS)
弓場 智之 YUBA, Tomoyuki [JP/JP]; JP (UsOnly)
藤田 陽二 FUJITA, Yoji [JP/JP]; JP (UsOnly)
富川 真佐夫 TOMIKAWA, Masao [JP/JP]; JP (UsOnly)
Inventors:
弓場 智之 YUBA, Tomoyuki; JP
藤田 陽二 FUJITA, Yoji; JP
富川 真佐夫 TOMIKAWA, Masao; JP
Agent:
岩見 知典 IWAMI, Tomonori; 〒5208558 滋賀県大津市園山1丁目1番1号 東レ株式会社知的財産部内 Shiga c/o Intellectual Property Department TORAY INDUSTRIES, INC. 1-1, Sonoyama 1-chome Otsu-shi, Shiga 520-8558, JP
Priority Data:
2005-19134630.06.2005JP
Title (EN) PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE ET AMPLIFICATEUR D’ADHÉSION
(JA) 感光性樹脂組成物および接着改良剤
Abstract:
(EN) A photosensitive resin composition comprising alkali soluble resin (a), silicon compound (b) having secondary aromatic amino and alkoxyl and at least one member (c) selected from among a photopolymerization initiator, a photoacid generator and a photobase generator. Thus, there can be obtained a photosensitive resin composition that without detriment to the storage stability of solution, strikingly enhances the adhesion with substrate after curing and even at development, is free from micropattern peeling.
(FR) Composition de résine photosensible comprenant une résine alcaline soluble (a), un composé de silicium (b) comportant un aromatique secondaire amino et alkoxyle et au moins un élément (c) sélectionné parmi un initiateur de photopolymérisation, un générateur de photoacide ou un générateur de photobase. La présente invention permet ainsi d’obtenir une composition de résine photosensible qui, sans détriment à la stabilité d’entreposage de la solution, améliore considérablement l’adhésion avec un substrat après cuisson et même au développement n'est pas sujette à un écaillage microscopique.
(JA)  本発明は、(a)アルカリ可溶樹脂、(b)2級の芳香族アミノ基およびアルコキシ基を有するケイ素化合物、および(c)光重合開始剤、光酸発生剤および光塩基発生剤から選ばれた少なくとも1つを含む感光性樹脂組成物である。本発明によれば、溶液の保存安定性を損なうことなく、キュア後の基板との接着性を著しく高めるとともに、現像時にも微細パターンが剥がれないような感光性樹脂組成物を得ることができる。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020080028464EP1909142JPWO2007004345US20090123867CN101213491JP5087923