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Machine translation
1. (WO2007004259) METHOD AND DEVICE FOR REMOVING MICRO COMPONENT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/004259    International Application No.:    PCT/JP2005/012071
Publication Date: 11.01.2007 International Filing Date: 30.06.2005
IPC:
H05K 3/34 (2006.01)
Applicants: FUJITSU LIMITED [JP/JP]; 1-1, Kamikodanaka 4-chome Nakahara-ku, Kawasaki-shi Kanagawa 2118588 (JP) (For All Designated States Except US).
YAMAMOTO, Keiichi [JP/JP]; (JP) (For US Only).
TAKESUE, Masakazu [JP/JP]; (JP) (For US Only).
FUJII, Masanao [JP/JP]; (JP) (For US Only).
OKADA, Toru [JP/JP]; (JP) (For US Only)
Inventors: YAMAMOTO, Keiichi; (JP).
TAKESUE, Masakazu; (JP).
FUJII, Masanao; (JP).
OKADA, Toru; (JP)
Agent: MATSUKURA, Hidemi; Acropolis 21 Building 6th Floor 4-10, Higashi Nihonbashi 3-chome Chuo-ku, Tokyo 103-0004 (JP)
Priority Data:
Title (EN) METHOD AND DEVICE FOR REMOVING MICRO COMPONENT
(FR) PROCÉDÉ ET DISPOSITIF D’ENLÈVEMENT DE MICROCOMPOSANT
(JA) 超微細部品の取り外し方法、及び装置
Abstract: front page image
(EN)A method and a device for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having a cross-sectional area falling within the surface (12a) of the micro component (12) opposite to the side of the substrate (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). The thermosetting adhesive (15) is then thermally cured to secure the component holding pin (13) and the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
(FR)L’invention concerne un procédé et un dispositif d’enlèvement d’un microcomposant en toute sécurité et de mise à niveau du brasage restant sur un substrat sans imposer de détérioration thermique aux appuis de brasage, aux substrats et aux composants à la périphérie. Un adhésif thermodurcissable (15) est disposé sur la surface (12a) d’un microcomposant (12) opposée au côté d’un substrat (11), et l’extrémité distale d’une goupille de maintien de composant (13) de section transversale inférieure à la surface (12a) du microcomposant (12) opposée au côté du substrat (11) passe à travers l’adhésif thermodurcissable (15) pour buter contre la surface (12a) du microcomposant (12). L’adhésif thermodurcissable (15) est alors vulcanisé thermiquement pour fixer la goupille de maintien de composant (13) et le microcomposant (12). Ensuite, le brasage (16) entre le microcomposant (12) et le substrat (11) est chauffé pour fondre et la goupille de maintien de composant (13) est déplacée dans la direction s’écartant du substrat (11). Ensuite, on retire le microcomposant (12) du substrat (11).
(JA) 超微細部品を確実に取り外すことができると共に、はんだランド、基板及び周囲の部品に熱的ダメージを与えずに、基板上に残存するはんだを整地できるようにする。  超微細部品12における基板11の反対側の表面12aに熱硬化性接着剤15を設け、超微細部品12における基板11の反対側の表面12a内に収まる大きさの断面積を有する部品保持用ピン13の先端を、熱硬化性接着剤15を通して超微細部品12の表面12aに当接させる。次に、熱硬化性接着剤15を加熱することにより硬化させて、部品保持用ピン13と超微細部品12とを固定する。また、超微細部品12と基板11間のはんだ16を加熱することにより、はんだ16を溶融し、部品保持用ピン13を基板11から離間する方向に移動させる。これによって、超微細部品12が基板11から取り外される。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)