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Machine translation
1. (WO2007004184) SOLID THERMALLY EXPANSIBLE MATERIAL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/004184    International Application No.:    PCT/IB2006/052218
Publication Date: 11.01.2007 International Filing Date: 30.06.2006
Chapter 2 Demand Filed:    01.02.2007    
IPC:
C08G 59/20 (2006.01), C08L 63/00 (2006.01)
Applicants: SIKA TECHNOLOGY AG [CH/CH]; Zugerstrasse 50, CH-6340 Baar (CH) (For All Designated States Except US).
ROSENBERG, Steven [US/US]; (US) (For US Only).
KOW, Cheong [US/US]; (US) (For US Only).
HOEFFLIN, Frank [DE/US]; (US) (For US Only).
FINTER, Juergen [DE/CH]; (CH) (For US Only).
BLANK, Norman [DE/CH]; (CH) (For US Only)
Inventors: ROSENBERG, Steven; (US).
KOW, Cheong; (US).
HOEFFLIN, Frank; (US).
FINTER, Juergen; (CH).
BLANK, Norman; (CH)
Agent: FORBIS, Glenn; 39533 Woodward Avenue Suite 140, Bloomfield Hills, Michigan 48304 (US)
Priority Data:
60/696,183 01.07.2005 US
Title (EN) SOLID THERMALLY EXPANSIBLE MATERIAL
(FR) MATÉRIAU SOLIDE THERMO-EXPANSIBLE
Abstract: front page image
(EN)A solid thermally expansible material is provided. The material includes a solid epoxy resin that is substantially free of liquid epoxy resin and semi-solid epoxy resin. The material also includes an impact modifier, a curing agent and a heat-activated foaming agent. The impact modifier includes rubber in one embodiment and is substantially free of rubber in another embodiment. Following heat activation, the material expands and can adhere to a substrate. A cured expanded reinforcement material is also provided, as is a method of reinforcing a substrate.
(FR)L'invention concerne un matériau solide thermo-expansible, qui comprend une résine époxyde solide sensiblement exempte de résine époxyde liquide et de résine époxyde semi-solide. Le matériau comprend également un antichoc, un agent de cuisson et un agent d'expansion sensible à la chaleur. L'antichoc comprend un caoutchouc dans un mode de réalisation, et est sensiblement exempt de caoutchouc dans un autre mode de réalisation. Après activation à chaud, le matériau se dilate et peut adhérer à un substrat. L'invention concerne également un matériau de renfort dilaté polymérisé, ainsi qu'un procédé de renforcement d'un substrat.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)