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1. WO2007004119 - A METHOD OF MANUFACTURING A MEMS ELEMENT

Publication Number WO/2007/004119
Publication Date 11.01.2007
International Application No. PCT/IB2006/052109
International Filing Date 27.06.2006
IPC
B81C 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81B 2203/0118
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
01Suspended structures, i.e. structures allowing a movement
0118Cantilevers
B81B 2203/0315
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
03Static structures
0315Cavities
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81C 1/00047
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00023without movable or flexible elements
00047Cavities
B81C 1/00182
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00134comprising flexible or deformable structures
00182Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
B81C 2201/0109
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2201Manufacture or treatment of microstructural devices or systems
01in or on a substrate
0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
0102Surface micromachining
0105Sacrificial layer
0109Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
Applicants
  • KONINKLIJKE PHILIPS ELECTRONICS N.V. [NL]/[NL] (AE, AG, AL, AM, AT, AU, AZ, BA, BB, BE, BF, BG, BJ, BR, BW, BY, BZ, CA, CF, CG, CH, CI, CM, CN, CO, CR, CU, CY, CZ, DK, DM, DZ, EC, EE, EG, ES, FI, FR, GA, GB, GD, GE, GH, GM, GN, GQ, GR, GW, HN, HR, HU, ID, IE, IL, IN, IS, IT, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MC, MD, MG, MK, ML, MN, MR, MW, MX, MZ, NA, NE, NG, NI, NL, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SI, SK, SL, SM, SN, SY, SZ, TD, TG, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, ZA, ZM, ZW)
  • PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH [DE]/[DE] (DE)
  • DEKKER, Ronald [NL]/[NL] (UsOnly)
  • LANGEREIS, Geert [NL]/[NL] (UsOnly)
  • POHLMANN, Hauke [DE]/[DE] (UsOnly)
  • DUEMLING, Martin [DE]/[DE] (UsOnly)
Inventors
  • DEKKER, Ronald
  • LANGEREIS, Geert
  • POHLMANN, Hauke
  • DUEMLING, Martin
Agents
  • NOLLEN, Maarten, D-J.
Priority Data
05105869.130.06.2005EP
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) A METHOD OF MANUFACTURING A MEMS ELEMENT
(FR) PROCEDE DE FABRICATION D'UN ELEMENT MICROELECTROMECANIQUE
Abstract
(EN) The device (100) comprises a substrate (10) of a semiconductor material with a first and an opposite second surface (1,2) and a microelectromechanical (MEMS) element (50) which is provided with a fixed and a movable electrode (52, 51) that is present in a cavity (30). One of the electrodes (51,52) is defined in the substrate (10). The movable electrode (51) is movable towards and from the fixed electrode (52) between a first gapped position and a second position. The cavity (30) is opened through holes (18) in the substrate (10) that are exposed on the second surface (2) of the substrate (10). The cavity (30) has a height that is defined by at least one post (15) in the substrate (10), which laterally substantially surrounds the cavity (15).
(FR) L'invention concerne un dispositif (100) présentant un substrat (10) en matériau semi-conducteur pourvu d'une première surface et d'une seconde surface opposée (1, 2) et un élément microélectromécanique (MEMS) (50) pourvu d'une électrode fixe et d'une électrode mobile (52, 51) qui se trouve dans une cavité (30). Une des électrodes (51, 52) est formée dans le substrat (10). L'électrode mobile (51) peut se déplacer vers et depuis l'électrode fixe (52) entre une première position écartée position et une seconde position. La cavité (30) est ouverte par le biais de trous (18) formés dans le substrat (10) et s'ouvrant sur la seconde surface (2) du substrat (10). Cette cavité (30) présente une hauteur définie par au moins un support (15) dans le substrat (10), qui entoure sensiblement les côtés de ladite cavité.
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