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1. (WO2007003572) METHOD FOR DEPOSITION OF A MATERIAL IN A HOLE IN AN ELECTRICALLY CONDUCTING WORKPIECE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/003572 International Application No.: PCT/EP2006/063680
Publication Date: 11.01.2007 International Filing Date: 29.06.2006
IPC:
C23C 14/04 (2006.01) ,C25D 5/02 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04
Coating on selected surface areas, e.g. using masks
C CHEMISTRY; METALLURGY
25
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
D
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
02
Electroplating of selected surface areas
Applicants:
SIEMENS AKTIENGESELLSCHAFT [DE/DE]; Wittelsbacherplatz 2 80333 München, DE (AllExceptUS)
JENSEN, Jens Dahl [DK/DE]; DE (UsOnly)
KRÜGER, Ursus [DE/DE]; DE (UsOnly)
MICHELSEN-MOHAMMADEIN, Ursula [DE/DE]; DE (UsOnly)
STEINBACH, Jan [DE/DE]; DE (UsOnly)
WINKLER, Gabriele [DE/DE]; DE (UsOnly)
Inventors:
JENSEN, Jens Dahl; DE
KRÜGER, Ursus; DE
MICHELSEN-MOHAMMADEIN, Ursula; DE
STEINBACH, Jan; DE
WINKLER, Gabriele; DE
Common
Representative:
SIEMENS AKTIENGESELLSCHAFT; Postfach 22 16 34 80506 München, DE
Priority Data:
10 2005 032 019.801.07.2005DE
Title (DE) VERFAHREN ZUM ABSCHEIDEN EINES MATERIALS IN EIN LOCH IN EINEM ELEKTRISCH LEITENDEN WERKSTÜCK
(EN) METHOD FOR DEPOSITION OF A MATERIAL IN A HOLE IN AN ELECTRICALLY CONDUCTING WORKPIECE
(FR) PROCEDE DE DEPOT D'UNE MATIERE DANS UN TROU MENAGE DANS UNE PIECE ELECTRIQUEMENT CONDUCTRICE
Abstract:
(DE) Es wird ein Verfahren zum Abscheiden eines Materials in ein Loch (210), welches sich von der Oberfläche (6) eines elektrisch leitenden Werkstückes (200) aus in das Werkstück (200) hinein oder durch dieses hindurch erstreckt, unter Verwendung eines elektrischen Feldes zur Verfügung gestellt. Das Verfahren umfasst die Schritte: - Aufbringen einer elektrisch leitenden Schutzschicht (8) auf die Oberfläche (16) des Werkstückes; - Abscheiden des Materials (13) in das Loch unter Verwendung des elektrischen Feldes; - Entfernen der elektrisch leitenden Schutzschicht (8).
(EN) The invention relates to a method for deposition of a material in a hole (210), which extends from the surface (6) of an electrically conducting workpiece (200) into or through said workpiece (200) by use of an electric field, comprising the steps: application of an electrically conducting protective layer (8) to the surface (16) of the workpieces, deposition of the material (13) in the hole by means of the electric field and removal of the electrically conducting protective layer (8).
(FR) L'invention concerne un procédé pour déposer une matière dans un trou (210) au moyen d'un champ électrique, ce trou (210) s'étendant à l'intérieur d'une pièce (200) électriquement conductrice ou à travers celle-ci à partir de la surface (6) de ladite pièce. Ce procédé consiste à appliquer une couche de protection (8) électriquement conductrice sur la surface (6) de la pièce, à déposer la matière (13) dans le trou au moyen du champ électrique, puis à éliminer la couche de protection (8) électriquement conductrice.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: German (DE)
Filing Language: German (DE)