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Machine translation
1. (WO2007003228) HARDWARE PROTECTION SYSTEM FOR SENSITIVE ELECTRONIC-DATA MODULES PROTECTING AGAINST EXTERNAL MANIPULATIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/003228    International Application No.:    PCT/EP2005/053111
Publication Date: 11.01.2007 International Filing Date: 30.06.2005
IPC:
H05K 1/14 (2006.01)
Applicants: SIEMENS AKTIENGESELLSCHAFT [DE/DE]; Wittelsbacherplatz 2, 80333 München (DE) (For All Designated States Except US).
WIMMER, Anton [DE/DE]; (DE) (For US Only)
Inventors: WIMMER, Anton; (DE)
Common
Representative:
SIEMENS AKTIENGESELLSCHAFT; Postfach 22 16 34, 80506 München (DE)
Priority Data:
Title (DE) HARDWARESCHUTZ FÜR SENSIBLE ELEKTRONIK-DATENBAUGRUPPEN GEGEN EXTERNE MANIPULATIONEN
(EN) HARDWARE PROTECTION SYSTEM FOR SENSITIVE ELECTRONIC-DATA MODULES PROTECTING AGAINST EXTERNAL MANIPULATIONS
(FR) SYSTEME POUR PROTEGER DU MATERIEL CONTRE LES MANIPULATIONS EXTERNES, DESTINE A DES MODULES DE DONNEES ELECTRONIQUES SENSIBLES
Abstract: front page image
(DE)In einen Schaltungsträger ist ein Hardwareschutz integriert. Dadurch ergibt sich ein in den Schaltungsträger in Form von Leiterplatten integriertes Sensorsystem, welches mit herkömmlicher 'Hightech'-Leiterplattentechnologie gefertigt werden kann und auf herkömmlichen Bestücklinien von Elektronikbaugruppenfertigungen bestückt und verarbeitet werden kann.
(EN)A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech' printed circuit board technology and can be equipped with and processed on traditional insertion lines of electronic module installations, is obtained.
(FR)Un système de protection de matériel est intégré à un support de circuit. Cela permet d'obtenir un système de détection intégré aux supports de circuit se présentant sous la forme de cartes de circuits imprimés, qui peut être fabriqué avec la technologie des cartes de circuits imprimés 'high-tech' courante, et peut recevoir de composants et être traité sur des lignes d'implantation courantes d'installations de fabrication de modules électroniques.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: German (DE)
Filing Language: German (DE)