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Machine translation
1. (WO2007003221) WAFER AND METHOD OF PLANARIZING A SURFACE OF A WAFER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/003221    International Application No.:    PCT/EP2005/008204
Publication Date: 11.01.2007 International Filing Date: 30.06.2005
IPC:
H01L 21/3105 (2006.01), H01L 21/321 (2006.01)
Applicants: FREESCALE SEMICONDUCTOR, INC. [US/US]; 6501 William Cannon Drive, Austin, TX 78735 (US) (For All Designated States Except US).
SMITH, Bradley [US/FR]; (FR) (For US Only)
Inventors: SMITH, Bradley; (FR)
Agent: WRAY, Antony, John; Freescale Semiconductor, Inc., Impetus Limited, Grove House, Lutyens Close, Chineham Court, Basingstoke, Hampshire RG24 8AG (GB)
Priority Data:
Title (EN) WAFER AND METHOD OF PLANARIZING A SURFACE OF A WAFER
(FR) GALETTE ET PROCÉDÉ DE PLANARISATION D’UNE SURFACE D'UNE GALETTE
Abstract: front page image
(EN)A Chemical Mechanical Polishing (CMP) process receives a pre­treated wafer (20), the pre-treated wafer (20) having an abrasive-containing sacrificial layer (26) disposed thereon. During polishing using the CMP process, the abrasive­containing sacrificial layer (26) is broken-down to release abrasive that is used to abrade a surface (22) of the wafer (20).
(FR)La présente invention concerne un procédé de polissage mécano-chimique (PMC) qui reçoit une galette prétraitée (20), la galette prétraitée (20) ayant une couche consommable contenant un abrasif (26) disposée dessus. Lors du polissage au moyen du procédé de PMC, la couche consommable contenant un abrasif (26) est dégradée de façon à libérer l'abrasif qui est utilisé pour éroder une surface (22) de la galette (20).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)