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1. (WO2007002337) METHODS OF FORMING THERMOELECTRIC DEVICES INCLUDING CONDUCTIVE POSTS AND/OR DIFFERENT SOLDER MATERIALS AND RELATED METHODS AND STRUCTURES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/002337    International Application No.:    PCT/US2006/024387
Publication Date: 04.01.2007 International Filing Date: 21.06.2006
IPC:
H01L 35/08 (2006.01), H01L 35/34 (2006.01)
Applicants: NEXTREME THERMAL SOLUTIONS [US/US]; P.O. Box 13981, 3040 Cornwallis Road, Research Triangle Park, NC 27709-3981 (US) (For All Designated States Except US).
O'QUINN, Brooks, C. [US/US]; (US) (For US Only).
VENKATASUBRAMANIAN, Rama [US/US]; (US) (For US Only).
SIIVOLA, Edward, P. [US/US]; (US) (For US Only)
Inventors: O'QUINN, Brooks, C.; (US).
VENKATASUBRAMANIAN, Rama; (US).
SIIVOLA, Edward, P.; (US)
Agent: MYERS BIGEL SIBLEY & SAJOVEC, P.A.; P.O. Box 37428, Raleigh, North Carolina 27627 (US)
Priority Data:
60/692,864 22.06.2005 US
Title (EN) METHODS OF FORMING THERMOELECTRIC DEVICES INCLUDING CONDUCTIVE POSTS AND/OR DIFFERENT SOLDER MATERIALS AND RELATED METHODS AND STRUCTURES
(FR) PROCEDES PERMETTANT DE FORMER DES DISPOSITIFS THERMOELECTRIQUES COMPRENANT DES BORNES CONDUCTRICES ET/OU DIFFERENTS MATERIAUX DE SOUDURE ET PROCEDES ET STRUCTURES ASSOCIES
Abstract: front page image
(EN)A method of forming a thermoelectric device may include forming a first electrically conductive trace, and bonding a thermoelectric element to the first electrically conductive trace. After bonding the thermoelectric element to the first electrically conductive trace, a metal post may be formed on the thermoelectric element so that the thermoelectric element is between the first electrically conductive trace and the metal post. After forming the metal post, the metal post may be bonded to a second electrically conductive trace so that the metal post is between the second electrically conductive trace and the thermoelectric element. Other related methods and structures are also discussed.
(FR)L'invention concerne un procédé de formation de dispositif thermoélectrique qui consiste à former un premier tracé électroconducteur, et à lier un élément thermoélectrique au premier tracé électroconducteur. Après avoir lié l'élément thermoélectrique au premier tracé électroconducteur, on peut former une borne métallique sur l'élément thermoélectrique de manière que l'élément thermoélectrique se trouve entre le premier tracé électroconducteur et la borne métallique. Après avoir formé la borne métallique, on peut lier cette dernière à un second tracé électroconducteur de manière que la borne métallique se trouve entre le second tracé électroconducteur et l'élément thermoélectrique. L'invention se rapporte aussi à d'autres procédés et structures associés.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)