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1. (WO2007002337) METHODS OF FORMING THERMOELECTRIC DEVICES INCLUDING CONDUCTIVE POSTS AND/OR DIFFERENT SOLDER MATERIALS AND RELATED METHODS AND STRUCTURES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/002337 International Application No.: PCT/US2006/024387
Publication Date: 04.01.2007 International Filing Date: 21.06.2006
IPC:
H01L 35/08 (2006.01) ,H01L 35/34 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
04
Structural details of the junction; Connections of leads
08
non-detachable, e.g. cemented, sintered, soldered
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35
Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
34
Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Applicants:
NEXTREME THERMAL SOLUTIONS [US/US]; P.O. Box 13981 3040 Cornwallis Road Research Triangle Park, NC 27709-3981, US (AllExceptUS)
O'QUINN, Brooks, C. [US/US]; US (UsOnly)
VENKATASUBRAMANIAN, Rama [US/US]; US (UsOnly)
SIIVOLA, Edward, P. [US/US]; US (UsOnly)
Inventors:
O'QUINN, Brooks, C.; US
VENKATASUBRAMANIAN, Rama; US
SIIVOLA, Edward, P.; US
Agent:
MYERS BIGEL SIBLEY & SAJOVEC, P.A.; P.O. Box 37428 Raleigh, North Carolina 27627, US
Priority Data:
60/692,86422.06.2005US
Title (EN) METHODS OF FORMING THERMOELECTRIC DEVICES INCLUDING CONDUCTIVE POSTS AND/OR DIFFERENT SOLDER MATERIALS AND RELATED METHODS AND STRUCTURES
(FR) PROCEDES PERMETTANT DE FORMER DES DISPOSITIFS THERMOELECTRIQUES COMPRENANT DES BORNES CONDUCTRICES ET/OU DIFFERENTS MATERIAUX DE SOUDURE ET PROCEDES ET STRUCTURES ASSOCIES
Abstract:
(EN) A method of forming a thermoelectric device may include forming a first electrically conductive trace, and bonding a thermoelectric element to the first electrically conductive trace. After bonding the thermoelectric element to the first electrically conductive trace, a metal post may be formed on the thermoelectric element so that the thermoelectric element is between the first electrically conductive trace and the metal post. After forming the metal post, the metal post may be bonded to a second electrically conductive trace so that the metal post is between the second electrically conductive trace and the thermoelectric element. Other related methods and structures are also discussed.
(FR) L'invention concerne un procédé de formation de dispositif thermoélectrique qui consiste à former un premier tracé électroconducteur, et à lier un élément thermoélectrique au premier tracé électroconducteur. Après avoir lié l'élément thermoélectrique au premier tracé électroconducteur, on peut former une borne métallique sur l'élément thermoélectrique de manière que l'élément thermoélectrique se trouve entre le premier tracé électroconducteur et la borne métallique. Après avoir formé la borne métallique, on peut lier cette dernière à un second tracé électroconducteur de manière que la borne métallique se trouve entre le second tracé électroconducteur et l'élément thermoélectrique. L'invention se rapporte aussi à d'autres procédés et structures associés.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)