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1. (WO2007002124) OPTICAL TRANSPONDER WITH PASSIVE HEAT TRANSFER
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/002124 International Application No.: PCT/US2006/024037
Publication Date: 04.01.2007 International Filing Date: 20.06.2006
IPC:
H04B 10/152 (2006.01) ,G02B 6/43 (2006.01)
H ELECTRICITY
04
ELECTRIC COMMUNICATION TECHNIQUE
B
TRANSMISSION
10
Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
12
Transmission through light guides, e.g. optical fibres
14
Terminal stations
152
Non-coherent direct-detection systems
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24
Coupling light guides
42
Coupling light guides with opto-electronic elements
43
Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Applicants:
INTEL CORPORATION [US/US]; 2200 Mission College Boulevard Santa Clara, California 95052, US (AllExceptUS)
AHRENS, Michael [US/US]; US (UsOnly)
Inventors:
AHRENS, Michael; US
Agent:
VINCENT, Lester, J. ; Blakely Sokoloff Taylor & Zafman 12400 Wilshire Boulevard, 7th Floor Los Angeles, CA 90025, US
Priority Data:
11/157,32520.06.2005US
Title (EN) OPTICAL TRANSPONDER WITH PASSIVE HEAT TRANSFER
(FR) TRANSPONDEUR OPTIQUE A TRANSFERT THERMIQUE PASSIF
Abstract:
(EN) According to embodiments of the present invention, an optical transponder module generates heat when operating and at least a copper heat wick and/or a copper block are disposed in the module body to perform passive transfer of heat from inside the optical transponder module to outside the optical transponder module. The heat wick may be soldered to thermal vias in the printed circuit board that is internal to the optical transponder module and positioned over the laser transmitter circuitry. The copper block may be positioned in a cutout in the optical transponder module body to acts as a heat spreader. Thermal grease, compounds, paste, interface material, etc., may be used to help the conduction of heat.
(FR) Des modes de réalisation de la présente invention concernent un module transpondeur optique générant de la chaleur lors de son fonctionnement, au moins une mèche à chaleur en cuivre et/ou un bloc de cuivre étant disposés dans le corps du module afin de réaliser un transfert thermique passif de l'intérieur du module transpondeur optique vers l'extérieur de ce dernier. La mèche à chaleur peut être soudée à des trous de liaison thermique de la carte de circuit imprimé au sein du module et placée au-dessus des circuits émetteurs laser. Le bloc de cuivre peut être disposé dans une entaille du corps du module transpondeur optique pour agir tel un dissipateur thermique. Une pâte thermoconductible, des composés, une pâte, un matériau d'interface, etc., peuvent être employés pour favoriser la conduction thermique.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1894327JP2008544700US20060285806JP4528343CN1901421