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1. (WO2007001865) PLASMA CONFINEMENT RINGS INCLUDING RF ABSORBING MATERIAL FOR REDUCING POLYMER DEPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/001865 International Application No.: PCT/US2006/023198
Publication Date: 04.01.2007 International Filing Date: 14.06.2006
IPC:
H01L 21/00 (2006.01) ,C23C 16/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
Applicants:
LAM RESEARCH CORPORATION [US/US]; 4650 Cushing Parkway Fremont, CA 94538-6470, US (AllExceptUS)
ROGERS, James, H. [US/US]; US (UsOnly)
Inventors:
ROGERS, James, H.; US
Agent:
SKIFF, Peter, K.; Buchanan Ingersoll PC P.O. Box 1404 Alexandria, VA 22313-1404, US
Priority Data:
11/155,49320.06.2005US
Title (EN) PLASMA CONFINEMENT RINGS INCLUDING RF ABSORBING MATERIAL FOR REDUCING POLYMER DEPOSITION
(FR) ANNEAUX DE CONFINEMENT DE PLASMA COMPRENANT UN MATÉRIAU ABSORBANT LES RF POUR RÉDUIRE LA DÉPOSITION DE POLYMÈRES
Abstract:
(EN) Plasma confinement rings are adapted to reach sufficiently high temperatures on plasma-exposed surfaces of the rings to substantially reduce polymer deposition on those surfaces. The plasma confinement rings include an RF lossy material effective to enhance heating at portions of the rings. A low-emissivity material can be provided on a portion of the plasma confinement ring assembly to enhance heating effects.
(FR) L’invention concerne des anneaux de confinement de plasma qui sont adaptés pour atteindre des températures suffisamment élevées des surfaces des anneaux exposées au plasma pour réduire sensiblement la déposition de polymères sur ces surfaces. Les anneaux de confinement de plasma comprennent un matériau avec pertes de RF permettant d’augmenter le chauffage de portions des anneaux. Un matériau à faible émissivité peut revêtir une portion de l'ensemble d'anneaux de confinement de plasma pour améliorer les effets de chauffage.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080025690JP2009500812JP2012099829CN101553900KR1020130023372MYPI 20062899
MYPI 2013002764