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1. (WO2007001700) POLISHING PAD COMPRISING MAGNETICALLY SENSITIVE PARTICLES AND METHOD FOR THE USE THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/001700 International Application No.: PCT/US2006/020194
Publication Date: 04.01.2007 International Filing Date: 24.05.2006
IPC:
B24B 37/04 (2006.01) ,B24D 13/14 (2006.01) ,B24B 1/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37
Lapping machines or devices; Accessories
04
designed for working plane surfaces
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
D
TOOLS FOR GRINDING, BUFFING OR SHARPENING
13
Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
14
acting by the front face
B PERFORMING OPERATIONS; TRANSPORTING
24
GRINDING; POLISHING
B
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
1
Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Applicants:
CABOT MICROELECTRONICS CORPORATION [US/US]; 870 North Commons Drive Aurora, IL 60504, US
Inventors:
MYERS, Ronald; US
PRASAD, Abaneshwar; US
Agent:
WESEMAN, Steven ; Legal Department Cabot Microelectronics Corporation 870 North Commons Drive Aurora, IL 60504, US
Priority Data:
11/158,18521.06.2005US
Title (EN) POLISHING PAD COMPRISING MAGNETICALLY SENSITIVE PARTICLES AND METHOD FOR THE USE THEREOF
(FR) TAMPON DE POLISSAGE COMPRENANT DES PARTICULES MAGNÉTIQUEMENT SENSIBLES ET SON PROCÉDÉ D’UTILISATION
Abstract:
(EN) The invention provides polishing pads comprising a deformable polishing pad body and magnetically sensitive particles dispersed therein, wherein one or more properties of the polishing pad are altered when in the presence of an applied magnetic field. The invention further provides a polishing system and a method for polishing a substrate involving such a polishing pad.
(FR) La présente invention concerne des tampons de polissage comprenant un corps de tampon de polissage déformable et des particules magnétiquement sensibles y étant dispersées, une ou plusieurs propriétés du tampon de polissage étant altérées lorsqu'un champ magnétique est appliqué. La présente invention concerne également un système de polissage et un procédé de polissage d’un substrat au moyen d’un tel tampon de polissage.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080020629IL187704EP1915234JP2008546551US20060286906CN101203355