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1. (WO2007001598) LEAD-FREE SEMICONDUCTOR PACKAGE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/001598 International Application No.: PCT/US2006/014625
Publication Date: 04.01.2007 International Filing Date: 19.04.2006
Chapter 2 Demand Filed: 24.04.2007
IPC:
H01L 21/60 (2006.01) ,H01L 23/498 (2006.01) ,B23K 35/26 (2006.01) ,C22C 13/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50
Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60
Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
48
Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488
consisting of soldered or bonded constructions
498
Leads on insulating substrates
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
24
Selection of soldering or welding materials proper
26
with the principal constituent melting at less than 400C
C CHEMISTRY; METALLURGY
22
METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
C
ALLOYS
13
Alloys based on tin
Applicants:
ADVANCED MICRO DEVICES, INC. [US/US]; One AMD Place Mail Stop 68 P.O. Box 3453 Sunnyvale, CA 94088-3453, US (AllExceptUS)
MASTER, Raj, N. [US/US]; US (UsOnly)
ANNAD, Srinivasan, Ashok [IN/SG]; SG (UsOnly)
PARTHASARATHY, Srinivasan [US/US]; US (UsOnly)
MUI, Yew, Cheong [SG/SG]; SG (UsOnly)
Inventors:
MASTER, Raj, N.; US
ANNAD, Srinivasan, Ashok; SG
PARTHASARATHY, Srinivasan; US
MUI, Yew, Cheong; SG
Agent:
DRAKE, Paul, S.; Advanced Micro Devices, Inc. 5204 East Ben White Boulevard Mail Stop 562 Austin, TX 78741, US
BROOKES BATCHELLOR LLP; 102-108 Clerkenwell Road London EC1M 5SA, GB
Priority Data:
11/167,42527.06.2005US
Title (EN) LEAD-FREE SEMICONDUCTOR PACKAGE
(FR) BOITIER DE SEMI-CONDUCTEURS SANS PLOMB
Abstract:
(EN) A package substrate (4) includes die solder pads (3) and pin solder fillets (5). The pin solder fillets (5) might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads (3) might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads (3) might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.
(FR) Un substrat de boîtier (14) comprend des pastilles de soudure de puce (3) et des filets de soudure de broche (5). Les filets de soudure de broche (5) peuvent renfermer entre approximativement 90% en poids et 99 % en poids d'étain et entre 10 % en poids et 1 % en poids d'antimoine. Les pastilles de soudure de puce (3) peuvent renfermer entre approximativement 4 % en poids et 8 % en poids de bismuth, entre approximativement 2 % en poids et approximativement 4 % en poids d'argent, entre approximativement 0 % en poids et 0.7 % en poids de cuivre et entre approximativement 87 % en poids et approximativement 92% en poids d'étain. Les pastilles de soudure de puce (3) peuvent renfermer entre approximativement 7 % en poids et approximativement 20 % en poids d'indium, entre approximativement 2 % en poids et 4.5 % en poids d'argent, entre approximativement 0 % en poids et approximativement 0.7 % en poids de cuivre, entre approximativement 0 % en poids et approximativement 0.5 en poids d'antimoine, et entre approximativement 74.3 % en poids et approximativement 90 % en poids d'étain.
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020080024217JP2008544572US20060289977CN101208790